Patents by Inventor Yueh-Yi Lai

Yueh-Yi Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230342945
    Abstract: A method and a system for remote sharing annotation trajectory in a three-dimensional space are provided. In response to activating a first electronic apparatus to display a first space, the first electronic apparatus obtains a first reference point of a designated object presented in the first space. After the first electronic apparatus displays the first space, the first electronic apparatus detects a three-dimensional movement trajectory of a target object in the first space, detects inflection point information of the three-dimensional movement trajectory and captures a diameter of the three-dimensional movement trajectory, and then sends the inflection point information and the diameter to a second electronic apparatus.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Yueh-Yi Lai, Yi-Heng Chou, Chia-Chung Chao
  • Patent number: 11162784
    Abstract: System and method for profile measurement are provided. The profile measurement system includes a light projector, an imaging device, a control system, and a processing unit. The light projector includes a light source, a mask, and an optical system. An aperture of the mask allows a portion of light to pass through and generates a pattern. The optical system includes a variable focal length lens element configured to project the pattern at different projection distances. The imaging device is configured to capture images of the pattern projected at the different projection distances. The control system is configured to control a projection distance of the light projector and a focus distance of the imaging device. The processing unit is configured to obtain in-focus pixels in the captured images, generate mask images, reconstruct a large depth of field pattern image based on the captured images and reconstruct the object profile.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 2, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Ludovic Angot, Yueh-Yi Lai
  • Publication number: 20210199425
    Abstract: System and method for profile measurement are provided. The profile measurement system includes a light projector, an imaging device, a control system, and a processing unit. The light projector includes a light source, a mask, and an optical system. An aperture of the mask allows a portion of light to pass through and generates a pattern. The optical system includes a variable focal length lens element configured to project the pattern at different projection distances. The imaging device is configured to capture images of the pattern projected at the different projection distances. The control system is configured to control a projection distance of the light projector and a focus distance of the imaging device. The processing unit is configured to obtain in-focus pixels in the captured images, generate mask images, reconstruct a large depth of field pattern image based on the captured images and reconstruct the object profile.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Ludovic Angot, Yueh-Yi Lai
  • Patent number: 10571252
    Abstract: A surface topography optical measuring system including image capture modules, a control module and a computation module is provided. Each image capture module includes an electronically controlled focal length tunable lens, an optical assembly and an image sensor, wherein the image capture modules respectively capture images at different heights between a lowest and a highest surfaces of an object. The control module is coupled to the image capture modules to independently control the image capture modules. The computation module is coupled to the control module and the image sensor of each image capture module, wherein the computation module perform calibration of the surface topography optical measuring system and assesses in-focused pixels in the captured images to measure a height difference between a highest and a lowest surfaces of the object or between any surfaces of interest of the object. A surface topography optical measuring method is also provided.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: February 25, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Ludovic Angot, Yueh-Yi Lai
  • Publication number: 20200025555
    Abstract: A surface topography optical measuring system including image capture modules, a control module and a computation module is provided. Each image capture module includes an electronically controlled focal length tunable lens, an optical assembly and an image sensor, wherein the image capture modules respectively capture images at different heights between a lowest and a highest surfaces of an object. The control module is coupled to the image capture modules to independently control the image capture modules. The computation module is coupled to the control module and the image sensor of each image capture module, wherein the computation module perform calibration of the surface topography optical measuring system and assesses in-focused pixels in the captured images to measure a height difference between a highest and a lowest surfaces of the object or between any surfaces of interest of the object. A surface topography optical measuring method is also provided.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 23, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Ludovic Angot, Yueh-Yi Lai
  • Patent number: 10008005
    Abstract: Measurement system and method for measuring multi-dimensions of an object are provided. A two-dimensional (2D) image capturing device captures at least one macro-2D image of the object. A three-dimensional (3D) information acquisition device acquires micro-3D measured data of the object. A integration and estimation device performs 2D and 3D image correction on macro-2D image and micro-3D measured data to map micro-3D measured data into macro-2D image to output 3D-topography data corresponding to macro-2D image of the object, and based on machine learning mechanism, performs matching procedure on at least one connection feature between any two positions in 3D-topography data with a database to elect an adapted model. Based on its corresponding to at least one fitting function, the integration and estimation device estimates the connection features of 3D-topography data to output at least one estimated feature amount, thereby obtaining measurement results corresponding to the object.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: June 26, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Yueh-Yi Lai, Kun-Lung Tseng, Zih-Jian Jhang
  • Publication number: 20180075618
    Abstract: Measurement system and method for measuring multi-dimensions of an object are provided. A two-dimensional (2D) image capturing device captures at least one macro-2D image of the object. A three-dimensional (3D) information acquisition device acquires micro-3D measured data of the object. A integration and estimation device performs 2D and 3D image correction on macro-2D image and micro-3D measured data to map micro-3D measured data into macro-2D image to output 3D-topography data corresponding to macro-2D image of the object, and based on machine learning mechanism, performs matching procedure on at least one connection feature between any two positions in 3D-topography data with a database to elect an adapted model. Based on its corresponding to at least one fitting function, the integration and estimation device estimates the connection features of 3D-topography data to output at least one estimated feature amount, thereby obtaining measurement results corresponding to the object.
    Type: Application
    Filed: November 16, 2016
    Publication date: March 15, 2018
    Inventors: Yueh-Yi LAI, Kun-Lung TSENG, Zih-Jian JHANG
  • Publication number: 20170169556
    Abstract: A workpiece measuring apparatus and a method for measuring a workpiece are provided. A first image of a first portion of a workpiece is captured, and a first location of the first portion is determined. A second image of a second portion is captured that is selected according to the first location and the location of a portion of the workpiece to be measured, and a second location of the second portion is determined. If the second image determines that the first location is correctly determined, a workpiece holding unit is moved along the original direction; otherwise, the second image replaces the first image, and the workpiece holding unit is moved along a new direction. Also, a third image of a third portion of the workpiece is further captured to replace the second image, until the third image determines that the second location is correctly determined.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 15, 2017
    Inventors: Yueh-Yi Lai, Chang-Shuo Wu