Abstract: A photosensitive semiconductor package with a lid is proposed, in which a chip carrier is formed with an encapsulant thereon, and the encapsulant is formed with a cavity for exposing a semiconductor chip mounted on the chip carrier. A top of the encapsulant is structured with a groove and at least a beveled portion that descends toward the groove and is associated with the groove. When a lid is attached onto the encapsulant by using an adhesive, the groove can temporarily retain excess adhesive with its flow being directed toward the groove by the beveled portion, so that undersirable adhesive loss and adhesive flash can both be prevented from occurrence, allowing the appearance of the semiconductor package to be well maintained.

Abstract: A quad flat non-leaded package leadframe for supporting a die in a semiconductor package. The leadframe includes a plurality of packaging unit. Each packaging unit has a plurality of leads around a central region. Each pair of neighboring packaging unit is connected by a dam bar. The connected regions between the dam bar and the leads of each neighboring packaging unit have a thickness smaller than the other regions.