Patents by Inventor Yuehong Fu
Yuehong Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979966Abstract: Disclosed is a coil assembly and an electromagnetic cooking appliance. The coil assembly includes: a coil base, including a bottom wall and a side wall; a first coil and a second coil, fixedly located at the bottom wall and the side wall respectively; and a plurality of magnetic stripe supporters, located at the coil base along a circumferential direction. Each magnetic stripe supporter includes a first mounting part, a second mounting part, and a connecting part connected to the first mounting part and the second mounting part. The coil assembly in the disclosure can effectively reduce the mounting space for the magnetic stripe supporter, and prevent the interference between the magnetic stripe supporter and the circuit board supporter in the electromagnetic cooking appliance.Type: GrantFiled: October 17, 2018Date of Patent: May 7, 2024Assignee: FOSHAN SHUNDE MIDEA ELECTRICAL HEATING APPLIANCES MANUFACTURING CO., LTD.Inventors: Zhengting Fu, Chuanbin Zhu, Xianhuai Chen, Linbo Zhu, Wei Chen, Wei Yuan, Yuquan Wu, Yuehong Qu
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Publication number: 20210166914Abstract: A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer perimeter of the ceramic layer is surrounded by an edge ring. An outer radius of the ceramic layer is greater than an inner radius of the edge ring such that an outer edge of the ceramic layer extends below the edge ring.Type: ApplicationFiled: January 18, 2021Publication date: June 3, 2021Inventors: Fangli HAO, Yuehong FU, Zhigang CHEN
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Patent number: 10910195Abstract: A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer perimeter of the ceramic layer is surrounded by an edge ring. An outer radius of the ceramic layer is greater than an inner radius of the edge ring such that an outer edge of the ceramic layer extends below the edge ring.Type: GrantFiled: January 5, 2017Date of Patent: February 2, 2021Assignee: Lam Research CorporationInventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Patent number: 10741425Abstract: A substrate support includes a baseplate, a ceramic layer arranged on the baseplate, a bond layer arranged in a first gap between the baseplate and the ceramic layer, a channel formed through the baseplate, the bond layer, and the ceramic layer, and a plug arranged in the channel. The plug includes a lower portion arranged in the baseplate and an upper portion arranged in the ceramic layer. The lower portion includes a pocket and sidewalls surrounding the pocket. The upper portion extends below the ceramic layer and the first gap into the pocket, the sidewalls of the lower portion overlap the upper portion, and a second gap between the upper portion and the lower portion is located within the pocket of the lower portion below the first gap.Type: GrantFiled: February 22, 2017Date of Patent: August 11, 2020Assignee: LAM RESEARCH CORPORATIONInventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Patent number: 10460978Abstract: A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.Type: GrantFiled: March 8, 2017Date of Patent: October 29, 2019Assignee: LAM RESEARCH CORPORATIONInventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Patent number: 10262887Abstract: A pin lifter assembly for a substrate support in a substrate processing system includes a lift pin having a shaft, an upper end, and a lower end, and an insert arranged around the lift pin. The insert defines a gap between the insert and the lift pin. A clamp assembly is arranged around the lower end of the lift pin. The lower end of the lift pin is secured within the clamp assembly such that the clamp assembly prevents vertical movement of the lift pin relative to the clamp assembly. The clamp assembly is configured to allow horizontal movement of the lower end of the lift pin within the clamp assembly.Type: GrantFiled: October 20, 2016Date of Patent: April 16, 2019Assignee: LAM RESEARCH CORPORATIONInventors: Fangli Hao, Yuehong Fu
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Patent number: 10187965Abstract: A plasma confinement apparatus, and method for confining a plasma are described and which includes, in one form of the invention, a plurality of electrically insulated components which are disposed in predetermined spaced relation, one relative to the others, and surrounding a processing region of a plasma processing apparatus, and wherein a plurality of passageways are defined between the respective insulated components; and at least one electrically conductive and grounded component forms an electrical field shielding for the processing region.Type: GrantFiled: December 16, 2013Date of Patent: January 22, 2019Assignee: ADVANCED MICRO-FABRICATION EQUIPMENT, INC. CHINAInventors: Tuqiang Ni, Jinyuan Chen, Qing Qian, Yuehong Fu, Zhaoyang Xu, Xusheng Zhou, Ye Wang
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Publication number: 20180261492Abstract: A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.Type: ApplicationFiled: March 8, 2017Publication date: September 13, 2018Inventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Publication number: 20180240688Abstract: A substrate support includes a baseplate, a ceramic layer arranged on the baseplate, a bond layer arranged in a first gap between the baseplate and the ceramic layer, a channel formed through the baseplate, the bond layer, and the ceramic layer, and a plug arranged in the channel. The plug includes a lower portion arranged in the baseplate and an upper portion arranged in the ceramic layer. The lower portion includes a pocket and sidewalls surrounding the pocket. The upper portion extends below the ceramic layer and the first gap into the pocket, the sidewalls of the lower portion overlap the upper portion, and a second gap between the upper portion and the lower portion is located within the pocket of the lower portion below the first gap.Type: ApplicationFiled: February 22, 2017Publication date: August 23, 2018Inventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Publication number: 20180190526Abstract: A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer perimeter of the ceramic layer is surrounded by an edge ring. An outer radius of the ceramic layer is greater than an inner radius of the edge ring such that an outer edge of the ceramic layer extends below the edge ring.Type: ApplicationFiled: January 5, 2017Publication date: July 5, 2018Inventors: Fangli Hao, Yuehong Fu, Zhigang Chen
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Publication number: 20180114716Abstract: A pin lifter assembly for a substrate support in a substrate processing system includes a lift pin having a shaft, an upper end, and a lower end, and an insert arranged around the lift pin. The insert defines a gap between the insert and the lift pin. A clamp assembly is arranged around the lower end of the lift pin. The lower end of the lift pin is secured within the clamp assembly such that the clamp assembly prevents vertical movement of the lift pin relative to the clamp assembly. The clamp assembly is configured to allow horizontal movement of the lower end of the lift pin within the clamp assembly.Type: ApplicationFiled: October 20, 2016Publication date: April 26, 2018Inventors: Fangli Hao, Yuehong Fu
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Publication number: 20140103805Abstract: A plasma confinement apparatus, and method for confining a plasma are described and which includes, in one form of the invention, a plurality of electrically insulated components which are disposed in predetermined spaced relation, one relative to the others, and surrounding a processing region of a plasma processing apparatus, and wherein a plurality of passageways are defined between the respective insulated components; and at least one electrically conductive and grounded component forms an electrical field shielding for the processing region.Type: ApplicationFiled: December 16, 2013Publication date: April 17, 2014Applicant: ADVANCED MICRO-FABRICATION EQUIPMENT, INC. ASIAInventors: Tom Ni, Jinyuan Chen, Qing Qian, Yuehong Fu, Zhaoyang Xu, Xusheng Zhou, Ye Wang
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Patent number: 8608851Abstract: A plasma confinement apparatus, and method for confining a plasma are described and which includes, in one form of the invention, a plurality of electrically insulated components which are disposed in predetermined spaced relation, one relative to the others, and surrounding a processing region of a plasma processing apparatus, and wherein a plurality of passageways are defined between the respective insulated components; and at least one electrically conductive and grounded component forms an electrical field shielding for the processing region.Type: GrantFiled: October 10, 2006Date of Patent: December 17, 2013Assignee: Advanced Micro-Fabrication Equipment, Inc. AsiaInventors: Tom Ni, Jinyuan Chen, Qing Qian, Yuehong Fu, Zhaoyang Xu, Xusheng Zhou, Ye Wang
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Publication number: 20090090695Abstract: A yttria insulator ring for use in a plasma processing apparatus is provided to minimize arcing between the apparatus and a ground extension, while also increasing a mean time between cleanings (MTBC). The yttria insulator ring may be located between a ground extension and a plasma generation zone, or gap, of the chamber of the apparatus, as well as between an edge ring and the ground extension. Compared to a quartz ring, the yttria insulator ring can also provide improved semiconductor substrate uniformity because of improved RF coupling as a result of decreased reactivity and increased dielectric constant.Type: ApplicationFiled: August 28, 2008Publication date: April 9, 2009Applicant: Lam Research CorporationInventors: Babak Kadkhodayan, Rajinder Dhindsa, Yuehong Fu
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Publication number: 20070085483Abstract: A plasma confinement apparatus, and method for confining a plasma are described and which includes, in one form of the invention, a plurality of electrically insulated components which are disposed in predetermined spaced relation, one relative to the others, and surrounding a processing region of a plasma processing apparatus, and wherein a plurality of passageways are defined between the respective insulated components; and at least one electrically conductive and grounded component forms an electrical field shielding for the processing region.Type: ApplicationFiled: October 10, 2006Publication date: April 19, 2007Inventors: Tom Ni, Jinyuan Chen, Qing Qian, Yuehong Fu, Zhaoyang Xu, Xusheng Zhou, Ye Wang
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Publication number: 20060043067Abstract: A yttria insulator ring for use in a plasma processing apparatus is provided to minimize arcing between the apparatus and a ground extension, while also increasing a mean time between cleanings (MTBC). The yttria insulator ring may be located between a ground extension and a plasma generation zone, or gap, of the chamber of the apparatus, as well as between an edge ring and the ground extension. Compared to a quartz ring, the yttria insulator ring can also provide improved semiconductor substrate uniformity because of improved RF coupling as a result of decreased reactivity and increased dielectric constant.Type: ApplicationFiled: August 26, 2004Publication date: March 2, 2006Inventors: Babak Kadkhodayan, Rajinder Dhindsa, Yuehong Fu