Patents by Inventor Yuehong Jin

Yuehong Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11150707
    Abstract: The disclosure relates to computer technical field, and provides a GPU with specific shape of casing and a host casing hardware configuration. Body of the casing of the GPU includes a rectangle of a notch, the notch is located on a corner of the rectangle and is in a right trapezoid shape. In the host casing hardware configuration, the 2U host casing is divided into front area and rear area; hard disk assembly and fan assembly are disposed on the front area; the rear area is divided into top area and bottom area; 4 GPUs and a GPU tray are disposed on the top area in a staggered relationship, and motherboard and CUP and motherboard connector disposed on the motherboard are disposed on bottom area. The disclosure provides an advantage of improving the arrangement density of the components in the host casing.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: October 19, 2021
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Er-Zhen Song, Yuehong Jin, Ji-Peng Xu
  • Publication number: 20210209718
    Abstract: The disclosure relates to computer technical field, and provides a GPU with specific shape of casing and a host casing hardware configuration. Body of the casing of the GPU includes a rectangle of a notch, the notch is located on a corner of the rectangle and is in a right trapezoid shape. In the host casing hardware configuration, the 2U host casing is divided into front area and rear area; hard disk assembly and fan assembly are disposed on the front area; the rear area is divided into top area and bottom area; 4 GPUs and a GPU tray are disposed on the top area in a staggered relationship, and motherboard and CUP and motherboard connector disposed on the motherboard are disposed on bottom area. The disclosure provides an advantage of improving the arrangement density of the components in the host casing.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 8, 2021
    Inventors: Er-Zhen SONG, Yuehong Jin, Ji-Peng XU