Patents by Inventor Yuelin (Kevin) Liang

Yuelin (Kevin) Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11807953
    Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.
    Type: Grant
    Filed: January 29, 2022
    Date of Patent: November 7, 2023
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
  • Publication number: 20220243350
    Abstract: An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.
    Type: Application
    Filed: January 29, 2022
    Publication date: August 4, 2022
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Chunyan (Cherie) Zhou, Dongqing (Gates) Peng, Yuelin (Kevin) Liang, Zhongxi Huang
  • Publication number: 20220243355
    Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
    Type: Application
    Filed: January 29, 2022
    Publication date: August 4, 2022
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics (Suzhou) Ltd.
    Inventors: Daiqiong (Diana) Zhang, Yuelin (Kevin) Liang, Dongqing (Gates) Peng, Chunyan (Cherie) Zhou, Zhongxi Huang