Patents by Inventor Yuelin Shen

Yuelin Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8852546
    Abstract: PCD materials comprise a diamond body having bonded diamond crystals and interstitial regions disposed among the crystals. The diamond body is formed from diamond grains and a catalyst material at high pressure/high temperature conditions. The diamond grains have an average particle size of about 0.03 mm or greater. At least a portion of the diamond body has a high diamond volume content of greater than about 93 percent by volume. The entire diamond body can comprise high volume content diamond or a region of the diamond body can comprise the high volume content diamond. The diamond body includes a working surface, a first region substantially free of the catalyst material, and a second region that includes the catalyst material. At least a portion of the first region extends from the working surface to depth of from about 0.01 to about 0.1 mm.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: October 7, 2014
    Assignee: Smith International, Inc.
    Inventors: Madapusi K. Keshavan, Youhe Zhang, Yuelin Shen, Anthony Griffo, Michael Janssen
  • Publication number: 20140223836
    Abstract: A cutting element may include a polycrystalline diamond layer and a reduced-CTE substrate comprising diamond particles disposed in a matrix material, wherein the diamond particles have a contiguity of 15% or less. Also, a cutting element may include a polycrystalline diamond layer and a reduced-CTE substrate comprising a matrix material, at least one diamond-filled region, and embedded diamond particles.
    Type: Application
    Filed: April 21, 2014
    Publication date: August 14, 2014
    Applicant: Smith International, Inc.
    Inventors: Yuelin Shen, Youhe Zhang, Jibin Shi, Yuri Burhan, Gregory T. Lockwood
  • Patent number: 8800691
    Abstract: A cutting element for a drill bit that includes an outer support element having at least a bottom portion and a side portion; and an inner rotatable cutting element, a portion of which is disposed in the outer support element, wherein the inner rotatable cutting element includes a substrate and a diamond cutting face having a thickness of at least 0.050 inches disposed on an upper surface of the substrate; and wherein a distance from an upper surface of the diamond cutting face to a bearing surface between the inner rotatable cutting element and the outer support element ranges from 0 to about 0.300 inches is disclosed.
    Type: Grant
    Filed: March 20, 2013
    Date of Patent: August 12, 2014
    Assignee: Smith International, Inc.
    Inventors: Yuelin Shen, Youhe Zhang, Zhou Yong, Jiaqing Yu, Madapusi K. Keshavan
  • Publication number: 20140216827
    Abstract: Cutter assemblies include an outer support and a cutting element disposed therein. The cutting element is immovably attached to the outer support element. Also disclosed is downhole tools incorporating such cutter assemblies and methods of making such downhole tools.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Applicant: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Yuri Burhan, Gregory T. Lockwood
  • Patent number: 8752656
    Abstract: A bottom hole assembly containing a drill bit. The drill bit additionally has a plurality of primary cutter elements mounted thereto. The plurality of cutter elements comprise one or more first cutter elements and one or more second cutter elements. The second cutter element differs from the first cutter element in at least one cutter element property. The first cutter element has a diamond body containing a first region comprising an infiltrant material disposed within the interstitial regions. The first region is located remote from the working surface of the diamond body. The first cutter element also contains a second region comprising interstitial regions that are substantially free of the infiltrant material. The second region is located along at least the working surface of the diamond body. Also included are a cutter element, method of designing a bottom hole assembly as well as method of designing a drill bit.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: June 17, 2014
    Assignee: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Madapusi K Keshavan, Peter T Cariveau
  • Patent number: 8727043
    Abstract: Cutter assemblies comprising an outer support element and a cutting element disposed therein. The cutting element is immovably attached to the outer support element. Also provided are downhole tools incorporating such cutter assemblies and methods of making such downhole tools.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: May 20, 2014
    Assignee: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Yuri Burhan, Gregory T. Lockwood
  • Publication number: 20140124271
    Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: Smith International, Inc.
    Inventors: J. Daniel Belnap, Georgiy Voronin, Feng Yu, Peter T. Cariveau, Youhe Zhang, Yuelin Shen, Guodong Zhan
  • Patent number: 8702825
    Abstract: A method of forming a cutting element that includes filling at least one non-planar region on an upper surface of a carbide substrate with a diamond mixture, subjecting the substrate and the diamond mixture to high pressure high temperature sintering conditions to form a reduced-CTE substrate having polycrystalline diamond that extends a depth into the reduced-CTE substrate in an interface region, and an upper surface made of a composite surface of diamond and carbide, and attaching a polycrystalline diamond body to the composite surface of the reduced-CTE substrate is disclosed.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: April 22, 2014
    Assignee: Smith International, Inc.
    Inventors: Yuelin Shen, Youhe Zhang, Jibin Shi, Yuri Burhan, Gregory T. Lockwood
  • Publication number: 20140041948
    Abstract: A cutting element is provided having a substrate and an ultra hard material cutting layer over the substrate. The cutting layer includes a surface portion for making contact with a material to be cut by the cutting element. The surface portion in cross-section has a curvature that has a varying radius of curvature. A bit incorporating such a cutting element is also provided.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 13, 2014
    Applicant: SMITH INTERNATIONAL INC.
    Inventors: YUELIN SHEN, YOUHE ZHANG, MICHAEL JANSSEN
  • Publication number: 20140034396
    Abstract: A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.
    Type: Application
    Filed: October 8, 2013
    Publication date: February 6, 2014
    Applicant: SMITH INTERNATIONAL, INC.
    Inventors: YOUHE ZHANG, YUELIN SHEN, MADAPUSI K. KESHAVAN
  • Publication number: 20140013671
    Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 16, 2014
    Applicant: SMITH INTERNATIONAL, INC.
    Inventors: J. DANIEL BELNAP, GEORGIY VORONIN, FENG YU, PETER T. CARIVEAU, YOUHE ZHANG, YUELIN SHEN, GUODONG ZHAN
  • Patent number: 8617274
    Abstract: The present invention relates to ultra-hard cutting elements, and in particular cutting elements or compacts formed by a pulsed electrical field assisted HPHT sintering process or a spark plasma HPHT sintering process. In an embodiment, a method of forming a polycrystalline ultra-hard material includes providing a mixture of ultra-hard particles, placing the mixture of ultra-hard particles into an enclosure, placing the enclosure into a press cell assembly having a heater, applying a repeated high-energy pulse of direct current to the heater to heat the ultra-hard particles, and pressing the enclosure at sufficient pressure to form a polycrystalline ultra-hard material.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: December 31, 2013
    Assignee: Smith International, Inc.
    Inventors: Guodong Zhan, Youhe Zhang, Yuelin Shen
  • Patent number: 8590130
    Abstract: A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: November 26, 2013
    Assignee: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Madapusi K. Keshavan
  • Publication number: 20130291442
    Abstract: A method for forming a thermally stable cutting element that includes forming at least one acid infusion pathway in a polycrystalline abrasive body containing a catalyzing material to be leached; and contacting at least a portion of the at least one acid infusion pathway in the polycrystalline abrasive body with a leaching agent is disclosed.
    Type: Application
    Filed: November 7, 2012
    Publication date: November 7, 2013
    Inventors: Youhe Zhang, Yuelin Shen
  • Patent number: 8567534
    Abstract: Cutting elements have substrates including end surfaces. TSP material layers extend over only a portion of the end surfaces or extend into the substrates below the end surfaces. Bits incorporate such cutting elements.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: October 29, 2013
    Assignee: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Madapusi K. Keshavan, Michael G. Azar
  • Patent number: 8567531
    Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: October 29, 2013
    Assignee: Smith International, Inc.
    Inventors: J. Daniel Belnap, Georgiy Voronin, Feng Yu, Peter T. Cariveau, Youhe Zhang, Yuelin Shen, Guodong Zhan
  • Patent number: 8499860
    Abstract: A cutting element is provided having a substrate and an ultra hard material cutting layer over the substrate. The cutting layer includes a surface portion for making contact with a material to be cut by the cutting element. The surface portion in cross-section has a curvature that has a varying radius of curvature. A bit incorporating such a cutting element is also provided.
    Type: Grant
    Filed: December 13, 2006
    Date of Patent: August 6, 2013
    Assignee: Smith International, Inc.
    Inventors: Yuelin Shen, Youhe (John) Zhang, Michael Janssen
  • Patent number: 8413746
    Abstract: A cutting element for a drill bit that includes an outer support element having at least a bottom portion and a side portion; and an inner rotatable cutting element, a portion of which is disposed in the outer support element, wherein the inner rotatable cutting element includes a substrate and a diamond cutting face having a thickness of at least 0.050 inches disposed on an upper surface of the substrate; and wherein a distance from an upper surface of the diamond cutting face to a bearing surface between the inner rotatable cutting element and the outer support element ranges from 0 to about 0.300 inches is disclosed.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: April 9, 2013
    Assignee: Smith International, Inc.
    Inventors: Yuelin Shen, Youhe Zhang, Zhou Yong, Jiaqing Yu, Madapusi K. Keshavan
  • Publication number: 20130074420
    Abstract: A method for forming a thermally stable cutting element that includes forming at least one acid infusion pathway in a polycrystalline abrasive body containing a catalyzing material to be leached; and contacting at least a portion of the at least one acid infusion pathway in the polycrystalline abrasive body with a leaching agent is disclosed.
    Type: Application
    Filed: November 7, 2012
    Publication date: March 28, 2013
    Inventors: Youhe Zhang, Yuelin Shen
  • Patent number: 8360176
    Abstract: A method for a down hole cutting tool is disclosed, wherein the cutting tool includes a cutting element support structure having at least one cutter pocket to support a cutting element comprising a substrate and an ultrahard layer. The method includes inserting a base portion of the cutting element into the cutter pocket; locating a first braze alloy such that when heated the first braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure adjacent the ultrahard layer; locating a second braze alloy such that when heated the second braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure non-adjacent the ultrahard layer; and heating the first and second braze alloy such that they melt.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 29, 2013
    Assignee: Smith International, Inc.
    Inventors: Youhe Zhang, Yuelin Shen, Hong Deng