Patents by Inventor Yuen Keung, Raymond CHIN

Yuen Keung, Raymond CHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antimicrobial Products Containing Silver and Copper Particles
    Publication number: 20230097291
    Abstract: This invention relates to an antimicrobial product containing silver-copper particles and its preparation method. The product includes a substrate and positively charged silver particles with a particle size of 15 ?m to 50 ?m, and a positively charged copper particle with a particle size of 10 ?m to 50 ?m, wherein the copper particle size ratio to the silver particle is 0.8 to 1.2. The silver particle, the copper particle and the substrate are combined by means of semi-fused sintering, wherein the ratio of the silver particle to the copper particle is 40:60 to 95:5. The sum of the substrate, the silver particles and the total particles of the copper particles is less than or equal to 10%.
    Type: Application
    Filed: December 31, 2021
    Publication date: March 30, 2023
    Inventor: Yuen Keung, Raymond CHIN
  • Hot melt fibers for antimicrobials and their preparation methods
    Publication number: 20210395922
    Abstract: This application relates to a hot-melt fiber containing silver particles, a preparation method thereof, and an article containing the hot-melt fiber.
    Type: Application
    Filed: July 26, 2021
    Publication date: December 23, 2021
    Inventors: Yuen Keung, Raymond CHIN, O Lun LEUNG