Patents by Inventor Yuen Ting Cheng

Yuen Ting Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip gettering
    Patent number: 11393697
    Abstract: Various semiconductor chips with gettering regions and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a first side and a second side opposite the first side. The first side has a plurality of laser ablation craters. Each of the ablation craters has a bottom. A gettering region is in the semiconductor chip beneath the laser ablation craters. The gettering region includes plural structural defects. At least some of the structural defects emanate from at least some of the bottoms of the laser ablation craters.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: July 19, 2022
    Assignee: ADVANCED MICRO DEVICES, INC
    Inventors: Rahul Agarwal, Milind S. Bhagavat, Ivor Barber, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok
  • SEMICONDUCTOR CHIP GETTERING
    Publication number: 20210050223
    Abstract: Various semiconductor chips with gettering regions and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a first side and a second side opposite the first side. The first side has a plurality of laser ablation craters. Each of the ablation craters has a bottom. A gettering region is in the semiconductor chip beneath the laser ablation craters. The gettering region includes plural structural defects. At least some of the structural defects emanate from at least some of the bottoms of the laser ablation craters.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Inventors: RAHUL AGARWAL, MILIND S. BHAGAVAT, IVOR BARBER, VENKATACHALAM VALLIAPPAN, YUEN TING CHENG, GUAN SIN CHOK
  • Semiconductor chip gettering
    Patent number: 10825692
    Abstract: Various semiconductor chips with gettering regions and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a first side and a second side opposite the first side. The first side has a plurality of laser ablation craters. Each of the ablation craters has a bottom. A gettering region is in the semiconductor chip beneath the laser ablation craters. The gettering region includes plural structural defects. At least some of the structural defects emanate from at least some of the bottoms of the laser ablation craters.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: November 3, 2020
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Rahul Agarwal, Milind S. Bhagavat, Ivor Barber, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok
  • SEMICONDUCTOR CHIP GETTERING
    Publication number: 20200203177
    Abstract: Various semiconductor chips with gettering regions and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a first side and a second side opposite the first side. The first side has a plurality of laser ablation craters. Each of the ablation craters has a bottom. A gettering region is in the semiconductor chip beneath the laser ablation craters. The gettering region includes plural structural defects. At least some of the structural defects emanate from at least some of the bottoms of the laser ablation craters.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Inventors: Rahul Agarwal, Milind S. Bhagavat, Ivor Barber, Venkatachalam Valliappan, Yuen Ting Cheng, Guan Sin Chok
  • REINFORCED TRAY STACK CONTAINER
    Publication number: 20160347498
    Abstract: Various box embodiments are disclosed. In one aspect, a box is provided that includes a container. The container has a bottom panel, a front panel, a first side panel, a second side panel, a back panel, a first reinforcement structure adjacent the back panel and the first side panel and a second reinforcement structure adjacent the back panel and the second side panel. The first and second reinforcement structures reinforce the back panel against compressive forces. A lid is coupled to the container.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 1, 2016
    Inventors: Donald L. Lambert, Curtis A. Rose, Yuen Ting Cheng, Sook Hoon Ng