Patents by Inventor Yueqiang Wang

Yueqiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Patent number: 11960147
    Abstract: The present disclosure relates to a loudspeaker. The loudspeaker may include a loudspeaker mechanism, a fixing mechanism, and a connector. The loudspeaker mechanism may be configured to generate a vibration signal and transmit the vibration signal to the human body. The fixing mechanism may be configured to support and maintain the position of the loudspeaker mechanism. The connector may be configured to connect the loudspeaker mechanism with the fixing mechanism. The loudspeaker mechanism may at least include a first fixed position and a second fixed position. The first fixed position may be a fixed position of the loudspeaker when the loudspeaker is in a non-working state. The second fixed position may be a fixed position of the loudspeaker when the loudspeaker is in a working state. The connector may be configured to switch the loudspeaker mechanism between the first fixed position and the second fixed position.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 16, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yueqiang Wang, Haofeng Zhang, Lei Zhang, Yongjian Li, Qian Chen
  • Patent number: 11940670
    Abstract: The present disclosure provides eyeglasses including an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; a connection wire, the connection wire passing through the rotating shaft wiring channel and extending to the eyeglass rim and the eyeglass temple, respectively; and a speaker, the speaker comprising an earphone core, and a core housing for accommodating the earphone core, the speaker being connected to the eyeglass temple.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: March 26, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yueqiang Wang, Haofeng Zhang, Yongjian Li, Yunbin Chen, Fen You, Lei Zhang
  • Patent number: 11940669
    Abstract: The present disclosure provides glasses including: a glasses rim; a glasses temple; a rotating shaft, the rotating shaft being configured to connect the glasses rim and the glasses temple, so that the glasses rim and the glasses temple are able to relatively rotate around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; a connection wire, the connection wire passing through the rotating shaft wiring channel and extending to the glasses rim and the glasses temple, respectively; and a speaker, the speaker comprising an earphone core, the speaker being connected to the glasses temple, the control circuit or the battery in the glasses temple driving the earphone core to vibrate to generate a sound through the connection wire.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: March 26, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yueqiang Wang, Haofeng Zhang, Yongjian Li, Yunbin Chen, Fen You, Lei Zhang
  • Patent number: 11906817
    Abstract: The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; and a speaker, the speaker comprising an earphone core, the speaker being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate through the connection wire, wherein the earphone core vibrates to generate a driving force to drive a housing panel of the speaker to vibrate, and a straight line of the driving force being not parallel to a normal line of the housing panel.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: February 20, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yueqiang Wang, Haofeng Zhang, Yongjian Li, Yunbin Chen, Fen You, Lei Zhang
  • Patent number: 11899284
    Abstract: The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; and a speaker, the speaker comprising an earphone core, the speaker being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate through the connection wire, wherein the earphone core vibrates to generate a driving force to drive a housing panel of the speaker to vibrate, and a straight line of the driving force being not parallel to a normal line of the housing panel.
    Type: Grant
    Filed: January 5, 2023
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yueqiang Wang, Haofeng Zhang, Yongjian Li, Yunbin Chen, Fen You, Lei Zhang
  • Patent number: D1014456
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
  • Patent number: D1014457
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
  • Patent number: D1014458
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
  • Patent number: D1016035
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 27, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang
  • Patent number: D1016778
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: March 5, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zhi Cai, Lei Zhong, Sunjie Huang, Zeteng Yan, Qian Chen, Piyou Cheng, Yueqiang Wang