Patents by Inventor Yuet CHEUNG

Yuet CHEUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method of determining a bonding position of a die
    Patent number: 10311597
    Abstract: The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kui Kam Lam, Shun Ming Fung, Chi Keung Leung, Wing Kin Lam, Yuet Cheung
  • APPARATUS AND METHOD OF DETERMINING A BONDING POSITION OF A DIE
    Publication number: 20180350097
    Abstract: The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.
    Type: Application
    Filed: June 2, 2017
    Publication date: December 6, 2018
    Inventors: Kui Kam LAM, Shun Ming FUNG, Chi Keung LEUNG, Wing Kin LAM, Yuet CHEUNG