Abstract: A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.

Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.

Abstract: A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.

Abstract: A power semiconductor module includes: a first metal substrate on which a power semiconductor device is mounted; a second metal substrate on which a power semiconductor device is not mounted; and an electrically insulating resin package which seals the first metal substrate and the second metal substrate. The back surface of the first metal substrate on the side opposite to the mounting surface of the power semiconductor device is made to expose outside the resin package to form a heat dissipation surface.

Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.

Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.

Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.

Abstract: Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.

Abstract: A case for a noise absorber including a first case member and a second case member. The first case member includes a first cable guide and a second cable guide at opposite sides and a first core housing provided therebetween. The second case member includes a third cable guide and a fourth cable guide at opposite sides and a second core housing provided therebetween. The first case member and the second case member are interlocked and a hinge arrangement movably connects one of the sides of the first case member with one of the sides of the second case member. A magnetic core having a cable through passage can be housed inside the case to provide a noise absorber.

Abstract: A noise absorber capable of preventing a cable from becoming damaged with a high degree of reliability while demonstrating outstanding noise absorbing characteristics is provided with a cover 1 and a pair of ferrites 21 and 22. The cover 1 is constituted through the combination of a first cover 11 and a second cover 12. The first cover 11 is provided with a ferrite storage portion 110 and a cable storage portion 111. The second cover 12 is provided with a ferrite storage portion 120 and a cable storage portion 121 . The ferrite storage portion 110 is formed at an internal surface of the first cover 11 and the ferrite storage portion 120 is formed at an internal surface of the second cover 12. The cable storage portion 111 is formed adjacent to the ferrite storage portion 110 at a side thereof, whereas the cable storage portion 121 is formed adjacent to the ferrite storage portion 120 at a side thereof.

Abstract: A noise absorber capable of preventing a cable from becoming damaged with a high degree of reliability while demonstrating outstanding noise absorbing characteristics is provided with a cover 1 and a pair of ferrites 21 and 22. The cover 1 is constituted through the combination of a first cover 11 and a second cover 12. The first cover 11 is provided with a ferrite storage portion 110 and a cable storage portion 111. The second cover 12 is provided with a ferrite storage portion 120 and a cable storage portion 121. The ferrite storage portion 110 is formed at an internal surface of the first cover 11 and the ferrite storage portion 120 is formed at an internal surface of the second cover 12. The cable storage portion 111 is formed adjacent to the ferrite storage portion 110 at a side thereof, whereas the cable storage portion 121 is formed adjacent to the ferrite storage portion 120 at a side thereof.