Patents by Inventor Yuezhan LIN

Yuezhan LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with laminated structure and manufacturing method thereof
    Patent number: 10926522
    Abstract: The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: February 23, 2021
    Assignee: TPK TOUCH SOLUTIONS (XIAMEN) INC.
    Inventors: Yuezhan Lin, Xu Zhang, Wei Huang
  • ELECTRONIC DEVICE WITH LAMINATED STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20160009065
    Abstract: The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates; thereby making an electronic device more firm with higher shock resistance.
    Type: Application
    Filed: September 21, 2015
    Publication date: January 14, 2016
    Inventors: Yuezhan Lin, Xu Zhang, Wei Huang
  • ELECTRONIC DEVICE WITH LAMINATED STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20130092521
    Abstract: The present disclosure relates to an electronic device, and more particularly, to an electronic device with laminated structure and a manufacturing method thereof. The electronic device comprises: a first substrate; a second substrate; and a solid-state adhesive layer, wherein the adhesive layer is disposed between the first substrate and the second substrate. The solid-state adhesive layer reacts with the first substrate and the second substrate to form a chemically linked chain for bonding the first substrate and the second substrate. The present disclosure further selects a solid-state adhesive with both physical and chemical cohesiveness to laminate the two substrates: thereby making an electronic device more firm with higher shock resistance.
    Type: Application
    Filed: July 12, 2012
    Publication date: April 18, 2013
    Inventors: Yuezhan LIN, Xu Zhang, Wei Huang