Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4?-diphenylmethane bismaleimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).

Abstract: The present invention discloses a thermosetting resin composition comprising: a bifunctional or multifunctional epoxy resin, a styrene-maleic anhydride (SMA) copolymer with a styrene/maleic anhydride molar ratio of 5-12:1 as a curing agent, a BPA epoxy resin with a low or high bromine content or tetrabromobisphenol A as a flame retardant agent, an accelerator and a solvent. The cured resin composition of the invention has a very low dielectric property, improved thermal reliability and better toughness. A copper clad laminate made of the resin composition and a reinforced material such as glass fiber cloth has a very low dielectric constant and dissipation factor, high Td, better toughness and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs and also applied to the common use of epoxy resins, such as molding resins, and composite materials for construction, automobiles and aviation.

Abstract: The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

Abstract: The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4?-diphenylmethane-amino-di-malays polyimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).

Abstract: The present invention pertains to a method for transversely soaking prepreg applied to the copper-clad laminate which initially supplies a prepreg to a bottom side of a basin filled with resin glue, and thence laterally transports the prepreg from the bottom side of the basin toward the top side thereof via guidances of revolving shafts disposed inside the basin. By means of the transverse route of the prepreg conducted by the revolving shafts, the time of soaking the prepreg in the basin is extended so as to reduce bubbles existed in the prepreg via fully immersing the resin glue throughout the prepreg and further increase the composite quality of the copper-clad laminate and the reliability of the metal resistant ion. Therefore, the present invention facilely gets acclimated to the industry without adding more equipment.

Abstract: The present invention discloses a thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride oligomers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: The present invention pertains to a device with revolving shafts for transversely soaking prepreg which comprises a basin filled with resin glue and revolving shafts disposed therein for laterally transporting a prepreg from the bottom side of the basin to the top side thereof. By means of the transverse route of the prepreg conducted by the revolving shafts, the time of soaking the prepreg in the basin is extended so as to reduce bubbles existed in the prepreg via fully immersing the resin glue throughout the prepreg and further increase the composite quality of the copper-clad laminate and the reliability of the metal resistant ion. Therefore, the present invention facilely gets acclimated to the industry without adding more equipment.