Patents by Inventor Yufei LUI

Yufei LUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9919916
    Abstract: A method of forming microneedles where through a series of coating and etching processes microneedles are formed from a surface as an array. The microneedles have a bevelled end and bore which are formed as part of the process with no need to use a post manufacturing process to finish the microneedle.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: March 20, 2018
    Assignee: Semitechnologies Llimited
    Inventors: Yufei Lui, Owen Guy
  • Publication number: 20160264408
    Abstract: A method of forming microneedles where through a series of coating and etching processes microneedles are formed from a surface as an array. The microneedles have a bevelled end and bore which are formed as part of the process with no need to use a post manufacturing process to finish the microneedle.
    Type: Application
    Filed: October 15, 2014
    Publication date: September 15, 2016
    Inventors: Yufei LUI, Owen GUY