Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Abstract: A drive backplane includes: a base substrate, binding electrodes, signal lines, and fan-out lines. The signal lines extend in a second direction and are arranged in a first direction. At least two signal lines have different lengths in the second direction. At least one fan-out line includes an oblique line portion and a first straight line portion. One end of the oblique line portion is coupled to the end of the signal line close to the binding electrode, and the other end thereof is coupled to the first straight line portion. The end of the first straight line portion away from the oblique line portion is coupled to the binding electrode. The distance, in a direction perpendicular to the first direction, between the two ends of the oblique line portion is a first distance, and the first distances of at least two oblique line portions are different.