Abstract: An ultrasonic-assisted permeation and homogenization molding device and method for frozen printing liquid drops are provided. The device includes an ultrasonic generator, a transducer and an amplitude-change pole. The ultrasonic generator generates 20 KHz low-frequency ultrasonic waves, and a flange plate is arranged on a pitch surface of the amplitude-change pole and connected with an outer cavity wall of the low-temperature molding chamber by threads. According to the ultrasonic-assisted permeation and homogenization molding method for frozen printing liquid drops, pre-paved molding sand particles are homogenized and distributed under ultrasonic vibration by adjusting the frequency of the ultrasonic generator in a sand paving process. When a pure water binder is sprayed, liquid drops are sprayed to the surface of premixed molding sand, and then permeate to the bottom of pre-cooled molding sand under the assistance of low-frequency ultrasonic waves to freeze and solidify.

Abstract: A temperature detector configured for use in a mobile terminal includes a lens, a collimator hole, and an infrared sensor that are arranged on an optical path. The lens is configured to converge ambient light, and the ambient light includes target area light and another area light. The collimator hole is used to obtain the target area light by screening and block the other area light. That is, the collimator hole screens the incident ambient light, and allows only the target area light to reach the infrared sensor.

Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.

Abstract: This application provides a display panel, a display apparatus, and a preparation method for a display panel. The display panel includes a plurality of pixel units, and each pixel unit includes at least three color subpixels. All subpixels of the pixel unit are packaged into one pixel unit by a passivation layer. Packaging and a transfer at the passivation layer are performed per pixel unit. Compared with transferring a single subpixel, this greatly reduces a quantity of pixel transfers, and reduces a probability of product damage in a transfer process, thereby helping improve manufacturing efficiency and a product yield. This can reduce a total quantity of electrodes of the display panel, reduce a quantity of electrodes that need to be welded when the pixel unit is transferred to a substrate with a drive circuit, improve process efficiency, and also improve a yield of the display panel.

Abstract: A clamp includes upper clamp assemblies, lower clamp assemblies, a base, a locking unit, a connecting rod arm, expandable arms and a central occluding woven net. The upper clamp assemblies and the lower clamp assemblies are quantitatively identical and cooperate in opening and closing to form a clamping portion. The clamp can effectively occlude the regurgitation on two sides of the clamp through the expandable arms on the two sides. By means of the central occluding woven net, the clamp can further reduce the central regurgitation, decrease the stress on the leaflet and prevent the damage to the leaflet; and the clamp firmly closes the lower clamp assemblies in a mechanical locking manner, such that the clamp does not drop easily after implanted into the body. The clamp can be implanted through the femoral vein puncture and transseptal puncture (TSP) with minimal invasion, to repair the mitral valve.

Abstract: The present invention discloses a novel valve clamping device and a valve clamping system. The valve clamping device includes a first clamping component, a second clamping component, and a fixing component for fixing the first clamping component and the second clamping component. The first clamping component has at least two first clamping arms. The second clamping component has a corresponding number of second clamping arms. Each of the first clamping arms and the corresponding second clamping arm may be combined into a pair of clamps. The clamping device may adopt designs of a smooth transition at the top, the clamping teeth having high clamping stability, and the fixed ring achieving the purpose of “one thread for two uses”.

Abstract: A clamp includes upper clamp assemblies, lower clamp assemblies, a base, a locking unit, a connecting rod arm, expandable arms and a central occluding woven net. The upper clamp assemblies and the lower clamp assemblies are quantitatively identical and cooperate in opening and closing to form a clamping portion. The clamp can effectively occlude the regurgitation on two sides of the clamp through the expandable arms on the two sides. By means of the central occluding woven net, the clamp can further reduce the central regurgitation, decrease the stress on the leaflet and prevent the damage to the leaflet; and the clamp firmly closes the lower clamp assemblies in a mechanical locking manner, such that the clamp does not drop easily after implanted into the body. The clamp can be implanted through the femoral vein puncture and transseptal puncture (TSP) with minimal invasion, to repair the mitral valve.

Abstract: In an image processing method, an image processing device obtains an input image from an image sensor. Each pixel of the input image is either a type-I pixel or a type-II pixel. Each type-I pixel carries a luminance channel value and no color data, and each type-II pixel carries a single color channel value and no luminance data, wherein the single color channel value is a cyan channel value, a magenta channel value, or a yellow channel value. The image processing device generates a target image by performing interpolation based on the luminance channel values and the single color channel values of the pixels of the input image, wherein each pixel in the target image corresponds in location to a pixel in the input image and has three color channel values generated by the interpolation.

Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.

Abstract: The present invention discloses a ring contraction device and a mounting method thereof, and relates to the field of medical instruments. The ring contraction device includes a plugging piece, a hemostatic disc, a puncture tube and a push rod. One end of the push rod penetrates through an inner cavity of the puncture tube and extends to the outside of the inner cavity of the puncture tube. The push rod is configured to push out the plugging piece in the puncture tube to be propped open. The hemostatic disc is further arranged at a pull wire to be connected to the plugging piece. A distance between the plugging piece and the hemostatic disc can be effectively adjusted through the pull wire, so as to achieve a ring contraction effect. The ring contraction device has a reasonable structure.

Abstract: This application discloses an image sensor, which includes a color film layer. The color film layer includes a plurality of color film units, the color film unit includes at least one color-determined subunit and at least three transparent subunits, and a color of the color-determined subunit is determined. The color-determined subunit is configured to filter out a portion of the received light, and the transparent subunit is configured to allow light to pass through. A ratio of a quantity of the at least one color-determined subunit to a quantity of the plurality of subunits is less than 1/2. Because the transparent subunit can allow light to pass through, and most of light incident to the color film layer can be received by a photodiode, light sensitivity of the image sensor can be effectively increased without increasing an area of the color film layer or increasing a size of the photodiode.

Abstract: The present invention discloses a novel valve clamping device and a valve clamping system. The valve clamping device includes a first clamping component, a second clamping component, and a fixing component for fixing the first clamping component and the second clamping component. The first clamping component has at least two first clamping arms. The second clamping component has a corresponding number of second clamping arms. Each of the first clamping arms and the corresponding second clamping arm may be combined into a pair of clamps. The clamping device may adopt designs of a smooth transition at the top, the clamping teeth having high clamping stability, and the fixed ring achieving the purpose of “one thread for two uses”.

Abstract: A waveguide filter, a preparation method thereof, and a communication device to resolve a problem in which a prepared high-resonance-frequency waveguide filter cannot meet an application requirement due to a low precision of an existing machining process. The waveguide filter includes a substrate made of a silicon material, where an etching cavity having a flat side wall is formed in the substrate, a depth of the etching cavity is not greater than 0.7 mm, and an angle between the side wall of the etching cavity and a vertical direction is not smaller than 1 degree, and a waveguide port is disposed on the substrate, where the waveguide port is connected to the etching cavity and electrically connected to the etching cavity.