Patents by Inventor Yu Feng Feng

Yu Feng Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor
    Patent number: 8946878
    Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: February 3, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Chee Keong Chin, Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos
  • Integrated circuit package system with window opening
    Patent number: 8901439
    Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 2, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: Chee Keong Chin, Yu Feng Feng, Guo Qiang Shen
  • Memory device system with stacked packages
    Patent number: 8288860
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: October 16, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu
  • INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
    Publication number: 20090146271
    Abstract: An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 11, 2009
    Inventors: Chee Keong Chin, Jae Hak Yee, Yu Feng Feng, Frederick Cruz Santos
  • MEMORY DEVICE SYSTEM WITH STACKED PACKAGES
    Publication number: 20090072378
    Abstract: An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a base contact pad on and adjacent to a second end of the base package for connection to an electrical interconnect.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 19, 2009
    Inventors: Chee Keong Chin, Yu Feng Feng, Wen Bin Qu
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WINDOW OPENING
    Publication number: 20080041964
    Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.
    Type: Application
    Filed: August 18, 2006
    Publication date: February 21, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Chee Keong Chin, Yu Feng Feng, Guo Qiang Shen
  • SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM
    Publication number: 20070284139
    Abstract: An integrated circuit package system is provided including providing an integrated circuit die, forming an encapsulation over the integrated circuit die, and sawing the encapsulation with a multi-level saw.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 13, 2007
    Inventors: Chee Keong Chin, Yu Feng Feng, Dan Feng Zhu, Feng Yao