Abstract: A proximity sensor device is provided in compact unit that has the ability to sense or monitor in different directions, such as sensing or monitoring in both the vertical and horizontal directions. Methods are also provided. In an illustrative embodiment, the proximity sensor device includes a first transmitting/receiving pair and a second transmitting/receiving pair on a printed circuit board along with an IC to control the transmitters and receivers, as well as, in some embodiments, to provide signal filtering, amplification or other desired features.

Abstract: A proximity sensor with movement detection is provided. The proximity sensor may provide a navigation function in response to movement of an object. The proximity sensor includes a driver operable to generate a current to a plurality of light sources in a particular timing sequence, a photo detector configured to receive light and generate an output signal, a controller configured to report the movement of an object near the proximity sensor if the output signal pattern generated matches one of the output signal patterns from among a set of known output signal patterns. The proximity sensor may be configured to provide a navigation operation when an object moves near the proximity sensor.

Abstract: A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.

Abstract: Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.

Abstract: A lens element comprising a base, a plurality of lens sections and a top lens section is disclosed. The plurality of lens sections are formed above a planar parallel to the base with each of the lens sections being positioned rotationally symmetric about an optical axis. The lens sections define a dome shape with every adjoining lens sections being conjugated with each other. A top lens section is formed at the center above the other lens sections and conjugated therewith. All of the lens sections are conjugated with each of its neighboring lens sections. Each of the lens sections has a optical property to direct light towards a target point. The target point may be positioned along the optical axis.

Abstract: In an embodiment, the invention provides a proximity sensor including a transmitter die, a receiver die, an ASIC die, a lead frame, wire bonds, a first transparent encapsulant, a second transparent encapsulant, and an opaque encapsulant. The transmitter die, the receiver die and the ASIC die are attached to portions of the lead frame. Wire bonds electrically connect the transmitter die, the receiver die, the ASIC die, and the lead frame. The first transparent encapsulant covers the receiver die, the ASIC die, the wire bonds, and a portion of the lead frame. The second transparent encapsulant covers the transmitter die, the wire bonds, and a portion of the lead frame. The opaque encapsulant covers portions of the first and second encapsulants and a portion of the lead frame.

Abstract: A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup.

Abstract: Immunogenic compositions and methods for eliciting an immune response against S. epidermidis and other related staphylococci are provided. The immunogenic compositions can include immunogenic conjugates of poly-?-glutamic acid (such as ?DLPGA) polypeptides of S. epidermidis, or related staphylococci that express a ?PGA polypeptide. The ?PGA conjugates elicit an effective immune response against S. epidermidis, or other staphylococci, in subjects to which the conjugates are administered. A method of treating an infection caused by a Staphylococcus organism that expresses cap genes is also disclosed. The method can include selecting a subject who is at risk of or has been diagnosed with the infection by the Staphylococcus organism which expresses ?PGA from the cap genes. Further, the expression of a ?PGA polypeptide by the organism can then be altered.

Abstract: Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

Abstract: Various embodiments of an optical sensor comprising a novel shield that may be quickly and accurately aligned and positioned with respect to an underlying light emitting and light detecting assembly are disclosed. Also disclosed are novel lens arrangements for efficiently collimating light emitted and received by the optical proximity sensor, and for reducing crosstalk.

Abstract: Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

Abstract: Various embodiments of a multiple-stage-molded optical proximity sensor and method of making same are disclosed. According to one embodiment, the method comprises mounting an infrared light emitter atop a first portion of a substrate, and mounting an infrared light detector, an ambient light detector and an integrated circuit atop a second portion of the substrate. In a first molding step, an infrared light pass component is molded over the substrate and the infrared light emitter, the infrared light detector, the ambient light detector, and the integrated circuit. The infrared light pass component is then cured, followed by forming a slot in the cured infrared light pass component between the first and second portions of the substrate. In a second molding step, an infrared light cut component is molded over the slot, the integrated circuit, the ambient light detector, and over portions of the infrared light emitter and the infrared light detector.

Abstract: Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

Abstract: Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.