Abstract: An electronic part includes amount substrate, a circuit substrate, a pad disposed on the circuit substrate, a bump that connects the mount substrate and the pad to each other, and a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad to a surface of the circuit substrate and has at least two openings adjacent to each other on the pad. The length equal to one-half the shortest distance from an end of one of the adjacent openings to an end of the other opening is smaller than the length of the shortest distance from the outer circumferential edge of the pad to the end of each of the openings, and the bump is provided in each of the two openings and layered on the surface protection film in a plan view.

Abstract: A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member.

Abstract: A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member.

Abstract: A sensor module includes a supporting member having three support faces orthogonal to one another, three IC chips each having connection terminals and external connection terminals on the side thereof where an active face is located, the three IC chips attached to the support faces of the supporting member on the sides thereof where passive faces lying along the active faces are located, three vibrating gyro elements each having a base, vibrating arms extending from the base, and connection electrodes, and flexible wiring substrates connected to the external connection terminals of the IC chips, each vibrating gyro element is disposed on the side of the IC chip where the active face is located, the connection electrodes are attached to the connection terminals of each IC chip such that one principal surface lies along the support face, and the flexible wiring substrate has a reinforcing layer.

Abstract: A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof; an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.

Abstract: A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of

Abstract: A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof, an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.

Abstract: A piezoelectric device includes a piezoelectric resonator and an electronic element mounted horizontally on an upper surface of a substrate, and the electronic element being lower in height than the piezoelectric resonator. The entire upper surface side of the substrate is covered with resin in a manner that the upper surface of the piezoelectric resonator is exposed outside.

Abstract: The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.

Abstract: A piezoelectric device includes, a substrate having a wiring pattern, a piezoelectric element package disposed on one surface side of the substrate and having a piezoelectric element housed therein, a circuit module, in which a module substrate mounts a circuit element, disposed on one surface side of the substrate, and a resin member covering the piezoelectric element package and the circuit module from the substrate.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.

Abstract: To provide a piezoelectric oscillator in which, even after a first package and a second package are bonded to each other, the connection state can be easily observed externally, so that testability can be enhanced, and connection failure can be easily found out to perform a repair. A piezoelectric oscillator includes a first package housing a piezoelectric resonator element therein and having external terminal portions connected to excitation electrodes of the piezoelectric resonator element, and a second package housing an oscillating circuit element, the first package being superposed on and fixed to the second package. Herein, in the second package, the oscillating circuit element, which is connected to a lead frame, is molded out of resin, and connection terminal portions and mounting terminals formed of the lead frame are exposed at the second package.

Abstract: The invention provides a piezoelectric oscillator having a reduced horizontal size and capable of being mounted in a small area. The invention also provides a portable telephone and an electronic device using such a piezoelectric oscillator. The piezoelectric oscillator includes a first package and a second package which are firmly connected to each other such that the second package is located on the first package. An oscillator circuit element is disposed in the first package, and a piezoelectric resonator is disposed in the second package. The first package includes a first lead frame and a second lead frame. End parts of the first lead frame are bent downward such that the bent portions at the lower end are exposed to the outside and serve as the first connection terminals. The second lead frame is placed on the first lead frame. End parts of the second lead frame are bent upward so as to serve as second connection terminals. The first connection terminals described above are used as mounting terminals.

Abstract: The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.