Abstract: A liquid ejection apparatus ejecting an aqueous ink and an aqueous reaction liquid containing a reactant that reacts with the aqueous ink to record an image on a record medium, wherein the liquid ejection apparatus includes an element substrate including: a plurality of individual channels having an ejection port configured to eject the liquid, a pressure chamber configured to supply the liquid to the ejection port, and an energy-generating element configured to generate energy to eject the liquid; an upstream channel configured to supply the liquid to the plurality of individual channels; and a downstream channel for outflow of the liquid from the plurality of individual channels, the ejection port has a protrusion protruding toward a center of the ejection port.

Abstract: An ink jet recording method including ejecting an aqueous ink from a first ejection port, and ejecting, from a second ejection port, an aqueous reaction liquid containing a reactant that reacts with the aqueous ink. The liquid ejection apparatus includes an element substrate having the second ejection port configured to eject the aqueous reaction liquid, a pressure chamber, and an energy-generating element, an upstream channel r, and a downstream channe, and the element substrate has a face configured to face the record medium in an ejection direction of the aqueous reaction liquid, wherein the method further including ejecting the aqueous reaction liquid from the second ejection port which is located closer to the pressure chamber than the face, and flowing the aqueous reaction liquid from the upstream channel to the downstream channel through the pressure chamber.

Abstract: The present invention addresses the problem of providing an ink-jet application type composition for wiring-line protection which can form layers that are excellent in terms of pattern retentivity and moisture resistance at high temperatures, have satisfactory adhesiveness to the circuits or metal wiring lines of the semiconductor device over a long period, and are less apt to suffer ion migration. The ink-jet application type composition for wiring-line protection comprises (A) one or more cationic photopolymerizable compounds including an alicyclic epoxy compound, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, wherein the silane coupling agent is contained in an amount of 1-50 parts by mass per 100 parts by mass of the cationic photopolymerizable compounds. The ink-jet application type composition for wiring-line protection has a viscosity, as measured with an E-type viscometer at 25° C. and 20 rpm, of 5-50 mPa·s.

Abstract: The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, etc. for long period of time. The protection member which is for a semiconductor and solves said problem, includes a cured article of an organic polymerizable compound having a functional group containing an oxygen atom and/or a nitrogen atom. The absolute value of the difference between the linear expansion coefficient at 150° C. of the cured article and the linear expansion coefficient at 25° C. of the cured article is 55 or less.

Abstract: The image display device sealing material contains a resin component and a curing agent, wherein the resin component contains biphenyl skeleton-containing epoxy resin having a weight-average molecular weight of 200 or more and 100,000 or less, alicyclic skeleton-containing epoxy resin having a weight-average molecular weight of 180 or more and 790 or less, and styrene oligomer having a weight-average molecular weight of 750 or more and 4000 or less.

Abstract: The image display device sealing material contains a resin component and a curing agent, wherein the resin component contains biphenyl skeleton-containing epoxy resin having a weight-average molecular weight of 200 or more and 100,000 or less, alicyclic skeleton-containing epoxy resin having a weight-average molecular weight of 180 or more and 790 or less, and styrene oligomer having a weight-average molecular weight of 750 or more and 4000 or less.

Abstract: The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G?(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×103 and 2.0×106 Pa.

Abstract: The purpose of the present invention is to provide a surface sealing material which has high storage stability and is capable of forming, on an object to be coated such as an organic EL element, a cured product layer that has less irregularity, cissing and the like, while having high surface smoothness. A surface sealing material for organic EL elements according to the present invention contains (B) a cationically polymerizable compound that comprises a cationically polymerizable functional group in each molecule and has a structure represented by formula (1) —(R—O)n— (wherein R represents an alkylene group having 2-5 carbon atoms and n represents an integer of 1-150), (C) a thermal cationic polymerization initiator and (D) a leveling agent.

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract: The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G?(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×103 and 2.0×106 Pa.

Abstract: The present invention addresses the issue of providing a surface sealing agent which can be cured at low temperatures and which exhibits excellent storage stability. In order to resolve this issue, provided is a surface sealing agent for an organic EL element, the surface sealing agent including an epoxy resin (A) having at least two epoxy groups in a molecule, and a curing accelerator (B) which is a salt of a specific quaternary ammonium ion, wherein 0.1-10 parts by weight of the curing accelerator (B) is contained relative to 100 parts by weight of the surface sealing agent.

Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.

Abstract: The purpose of the present invention is to provide a polymerizable resin composition with which the cured product refractive index is high and the viscosity under a high shear stress is a specific viscosity or lower. Provided is an polymerizable epoxy composition comprising (A1) an S-containing epoxy resin represented by a general formula, (A2) an epoxy compound having a softening point of 70° C. or lower, (B) a curing promoter, and (C) a thiol compound having two or more thiol groups per molecule, wherein viscosity at 25° C. and 60 rpm as determined using a B viscometer is between 100 and 15,000 mPa·s.

Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.

Abstract: The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

Abstract: The bonding method of the present invention is a method of bonding a member (a) having a layer (a1) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a).

Abstract: A sealing material for a flat panel display contains 100 parts by weight of a compound (A) containing at least one epoxy group in the molecule, and 0.01 to 40 parts by weight of a compound (B) that generates a base upon irradiation. The compound (B) that generates a base upon irradiation is preferably a compound that generates a tertiary amine upon irradiation. The sealing material has favorable curability at low temperature, and a long pot life at room temperature, and does not cause deterioration of display members with ionic components and acids.

Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.

Abstract: The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

Abstract: A sealing material for a flat panel display contains 100 parts by weight of a compound (A) containing at least one epoxy group in the molecule, and 0.01 to 40 parts by weight of a compound (B) that generates a base upon irradiation. The compound (B) that generates a base upon irradiation is preferably a compound that generates a tertiary amine upon irradiation. The sealing material has favorable curability at low temperature, and a long pot life at room temperature, and does not cause deterioration of display members with ionic components and acids.