Abstract: The present invention is an electropolishing process and device for electropolishing an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 and 5 cm. Wherein, the present invention comprises at least one tube, and one complex electrode. An inner surface of the tube is for electropolishing process, and it is an anode as well. The electrode is a cathode and placed on a center of a partition. An end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved the electrode toward the axial mechanism itself. Inside of the tube is full o electrolyte, which is an electrifying medium to connect both anode and cathode. Further, electrolyte cooperates with the electrode to perform the electropolishing process on the inner surface of tube.

Abstract: The present invention is an electropolishing process means for an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 to 5 cm. Wherein, the present invention comprises at least one tube, one complex electrode; an inner surface of the tube is for electropolishing process, and it is an anode as well; the electrode is a cathode and placed on a center of a partition; an end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved toward the axial mechanism itself; inside tube are full of electrolyte, which is an electrifying medium to connect both anode and cathode, further, electrolyte cooperates with electrode to move for electropolishing process the inner surface of tube.

Abstract: A membrane probe card is provided. The membrane probe card includes a pressure mechanism having an upper-housing and a support block. The support block has a spring system for providing a distance of travel to the support block. A printed circuit board is coupled to the pressure mechanism for providing electrical connection to a test apparatus. A membrane assembly is coupled to the pads on a wafer for providing electric connection to the printed circuit board. The membrane assembly is a replaceable and modularized component for application to integrated circuits with various layouts and dimensions.