Abstract: A dielectric ceramic composition is disclosed. The dielectric ceramic composition of the present invention comprises BaTiO3 as the main component and one or more subcomponents. The one or more subcomponents include Sc2O3, MgCO3, BaSiO3, MnCO3, La2O3, CO3O4 and NiO. An end product of the present invention may be formed after BaTiO3 and the subcomponents undergo the following steps: (1) Wet mixing using a ball mill (2) Sintering in a reducing atmosphere (3) Annealing. The dielectric ceramic composition of the present invention can satisfy the X8R characteristic of the EIA standard and is compact or dense enough.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A dielectric ceramic composition is disclosed. The dielectric ceramic composition of the present invention comprises BaTiO3 as the main component and one or more subcomponents. The one or more subcomponents include Sc2O3, MgCO3, BaSiO3, MnCO3, La2O3, CO3O4 and NiO. An end product of the present invention may be formed after BaTiO3 and the subcomponents undergo the following steps: (1) Wet mixing using a ball mill (2) Sintering in a reducing atmosphere (3) Annealing. The dielectric ceramic composition of the present invention can satisfy the X8R characteristic of the EIA standard and is compact or dense enough.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 15 to 40 volume % of a second heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.

Abstract: The present invention relates to a low-temperature sintered barium titanate microwave dielectric ceramic material. The host matrix thereof can be represented by BaxTiyMzOx+2y+k, where x is 1˜6, y is 1˜17, z is 0˜1, k is 0˜3, M is an element substituting the Ba or Ti ion, for example selected from an alkali metal, an alkaline-earth metal, a transition group or a rare earth group, and preferably Ba2Ti9O20 or the host matrix containing Zr, Sn, Zn, etc. According to the present invention, a low melting glass is added and a subsequent milling operation is performed to reduce the sintering temperature of the microwave dielectric ceramic material to less than 1,000° C. The low melting glass can be for example the Ba—B—Si—Li glass, Ba—B—Zn—Si—Li glass, Ba—B—Si—Li—Cu glass or Cu—B—Zn—Si—Li glass.

Abstract: The present invention relates to a low-temperature sintered barium titanate microwave dielectric ceramic material. The host matrix thereof can be represented by BaxTiyMZOX+2y+k, where x is 1˜6, y is 1˜17, z is 0˜1, k is 0˜3, M is an element substituting the Ba or Ti ion, for example selected from an alkali metal, an alkaline-earth metal, a transition group or a rare earth group, and preferably Ba2Ti9O20 or the host matrix containing Zr, Sn, Zn, etc. According to the present invention, a low melting glass is added and a subsequent milling operation is performed to reduce the sintering temperature of the microwave dielectric ceramic material to less than 1,000° C. The low melting glass can be for example the Ba-B-Si-Li glass, Ba-B-Zn-Si-Li glass, Ba-B-Si-Li-Cu glass or Cu-B-Zn-Si-Li glass.