Abstract: A method for surface treatment is disclosed. The method is achieved by forming a MgO film on a metal surface through anode processing of Mg or Mg alloy in an alkaline solution. The alkaline solution includes a hydroxide, a thickening agent, and a film adjusting agent. As the method is performed, the target object is immersed in the alkaline solution, and the target object is connected to an anode with an average electric current density of 1˜5 A/dm, at a temperature of 0˜30° C., and within a time period of 10˜120 minutes to form a film of 5˜25 ?m. The forming rate of the film of the method of the present invention is fast, and the formed film is of little stress.

Abstract: The present invention discloses a method for forming a metallic microstructure on a patterned surface of a substrate by a nonisothermal deposition (NTID) in an electroless plating solution. The substrate is immersed in the solution being heated by a heating device mounted on a bottom of an electroless plating reactor while the heated solution being cooled by a cooling device provided in the reactor, and thus a seed layer is formed the patterned surface of the substrate. The substrate is then immersed in an electroless plating solution with a back surface of the substrate lying on the bottom of the reactor, so that the exposed seed layer is thickened to form the metallic microstructure.

Abstract: A method for synthesizing monodipersive polymeric microspheres is disclosed. The method can control the diameter distribution of the microspheres and make it homogeneous. The manufactured polymeric microspheres also have plural functional groups on the surface for depositing metal particles thereon through redox. Moreover, the metal particles can be distributed on the surface of the polymeric microspheres homogeneously.

Abstract: A method for depositing a copper layer on a substrate is disclosed. The method is achieved by heating a plating solution located between a heating device and a target substrate. Through the process illustrated above, metal nano-particles come out from the plating solution and deposit on a substrate with high aspect ratio. Surfactant can be selectively added for obtaining ultra-thin continuous film, void-free copper connectors. Furthermore, a copper film would achieve a preferred (111) crystallization orientation.

Abstract: A method for metallizing a surface of substrates is disclosed. Particularly, nonhomogeneous heating deposition occurs by setting the surface and the heater in an electroless plating reactor at different temperatures. Moreover, an adjustable gap is defined between the substrate being metalized and heating source board. The deposit can securely adhere to the surface of the substrate for gap creates and activates metallic nanoparticles, which possess higher activity and bonding strength to the surface. Accordingly, metallization of the surface of the substrate can be easily achieved without using precious metals and carcinogenic materials.

Abstract: The present invention discloses a method for treating magnesium alloys by chemical conversion. This method can improve corrosion resistance and paint adhesion of magnesium alloys, and produces an admirable appearance. Additionally, the method of the present invention is more environmentally friendly than conventional processes, because non-chromate chemicals are used in acid pickling and chemical conversion. Furthermore, the method of the present invention can be widely applied to the magnesium alloys manufactured by casting and rolling.

Abstract: The present invention discloses a method for treating magnesium alloys by chemical conversion. This method can improve corrosion resistance and paint adhesion of magnesium alloys, and produces an admirable appearance. Additionally, the method of the present invention is more environmentally friendly than conventional processes, because non-chromate chemicals are used in acid pickling and chemical conversion. Furthermore, the method of the present invention can be widely applied to the magnesium alloys manufactured by casting and rolling.

Abstract: The present invention discloses a method for operating and controlling electroless plating, which comprises plating a substrate with a plating solution, the substrate is controlled at a constant temperature between 25° C. to 200° C., and the plating solution is kept at a lower temperature than that of the substrate. According to the method of the present invention, superior depositing rates can be achieved, undesired spontaneous decomposition of the plating solution at high temperature can be avoided and no stabilizers are necessary.

Abstract: A method for treating aluminum to enhance corrosion resistance of its surface. The chemical conversion coating aluminum and aluminum alloys are exposed to an aqueous PU solution to form a PU film on the surface. The aqueous PU solution comprises: (i) 5-15% weight of water dispersable polyurethane resin, (ii) 0.1-56 weight of cross-linking agent, and (iii) 80-94.9% weight of water.