Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A method for fabricating a display is provided. The method includes providing a substrate having a pixel area, forming a plurality of patterned first electrodes on the pixel area, forming a plurality of partitions on both sides of the patterned first electrodes, respectively filling in spaces between the partitions with various colored material to cover the patterned first electrodes by a depositing process, and forming a cover on the partitions and the colored materials.

Abstract: Fabrication methods for electronic devices with via through holes and thin film transistor devices are presented. The fabrication method the electronic device includes providing a substrate, forming a patterned lower electrode on the substrate, and forming a photosensitive insulating layer on the substrate covering the patterned lower electrode. A patterned optical shielding layer is applied on the photosensitive insulating layer. Exposure procedure is performed curing the exposed photosensitive insulating layer. The optical shielding layer and the underlying photosensitive insulating layer are sequentially removed, thereby forming an opening. A patterned upper electrode is formed on the photosensitive insulating layer filling the opening to create a conductive via hole.

Abstract: Bi-stable display systems and driving methods thereof are presented. The bi-stable display system includes a bi-stable display panel having at least one substrate, at least one electrode disposed on the substrate, and a bi-stable display medium between the at least one electrode, wherein the at least one electrode extends to pluralities of electrode pads on the at least one side of peripheral regions. A data input device for inputting display data to the bi-stable display panel includes a plurality of input terminals corresponding to the electrode pads of the bi-stable display panel. A trigger device detects relative movement between the bi-stable display panel and the data input device and generates a trigging signal to shift data address in a data shifter, thereby renewing image data in the bi-stable display panel.

Abstract: An Inkjet apparatus is provided. An Inkjet apparatus includes a piezoelectric inkjet print head, a plurality of driving unit, a detection unit and a control unit. The piezoelectric inkjet print head comprises a plurality of nozzles, wherein each the nozzle outputs an ink drop according to a driving voltage. The driving unit generates the driving voltage according to a control signal. The detection unit detects a state of the ink drop corresponding to the nozzle to generate a detection signal. The control unit generates the control signal to control the driving voltage according to the detection signal.

Abstract: A color backlight device and fabrication method thereof is provided. A surface conduction emitter display with more than one color serves as the color backlight device. The color backlight device can be used in a liquid crystal display (LCD) to obviate the use of a color filter. The disclosure also provides a color display control method of the LCD and a pixel arrangement method of the color backlight device.

Abstract: A transistor-type pressure sensor is provided, having an upper and a lower substrates, a source/drain formed on the lower substrate and separated from each other, a channel layer formed between and on the source/drain, a dielectric layer and a gate. The gate is substantially formed between the source and the drain. The surface of the gate, being in contact with the dielectric layer, has a stepped surface profile, so that the channel length/width ratio can be changed due to the pressure sensed by the pressure sensor.

Abstract: Fabrication methods for electronic devices with via through holes and thin film transistor devices are presented. The fabrication method the electronic device includes providing a substrate, forming a patterned lower electrode on the substrate, and forming a photosensitive insulating layer on the substrate covering the patterned lower electrode. A patterned optical shielding layer is applied on the photosensitive insulating layer. Exposure procedure is performed curing the exposed photosensitive insulating layer. The optical shielding layer and the underlying photosensitive insulating layer are sequentially removed, thereby forming an opening. A patterned upper electrode is formed on the photosensitive insulating layer filling the opening to create a conductive via hole.

Abstract: Bi-stable display systems and driving methods thereof are presented. The bi-stable display system includes a bi-stable display panel having at least one substrate, at least one electrode disposed on the substrate, and a bi-stable display medium between the at least one electrode, wherein the at least one electrode extends to pluralities of electrode pads on the at least one side of peripheral regions. A data input device for inputting display data to the bi-stable display panel includes a plurality of input terminals corresponding to the electrode pads of the bi-stable display panel. A trigger device detects relative movement between the bi-stable display panel and the data input device and generates a trigging signal to shift data address in a data shifter, thereby renewing image data in the bi-stable display panel.

Abstract: A method of fabricating a color organic electroluminescent display involves forming cathode electrodes on a substrate, and forming a first organic semiconductor layer having an electron-injection transporting property on the cathode electrodes. Solutions containing organic light-emitting material that can dissolve portions of the first organic semiconductor layer are patterned on the first organic semiconductor layer. Then, a solvent in the solutions is removed to form regions having second organic semiconductor layers and mixed organic semiconductor layers, wherein the second organic semiconductor layers are formed on the first organic semiconductor layer and are mostly composed of the organic light-emitting material, and the mixed organic semiconductor layers, composed of the organic light-emitting material and material constituting the first organic semiconductor layer, are embedded in the first organic semiconductor layer. Anode electrodes are formed over the first and second organic semiconductor layers.

Abstract: A method for fabricating a display is provided. The method includes providing a substrate having a pixel area, forming a plurality of patterned first electrodes on the pixel area, forming a plurality of partitions on both sides of the patterned first electrodes, respectively filling in spaces between the partitions with various colored material to cover the patterned first electrodes by a depositing process, and forming a cover on the partitions and the colored materials.

Abstract: A micro device and manufacturing method thereof. The micro device includes a substrate, an insulation layer, and a solution. The insulation layer is disposed on the substrate to define a channel portion and an extension portion communicated with the channel portion. The solution is location in the channel portion. Part of the solution flows to the extension portion by capillary force between the channel portion and the extension portion.

Abstract: A transistor-type pressure sensor is provided, having an upper and a lower substrates, a source/drain formed on the lower substrate and separated from each other, a channel layer formed between and on the source/drain, a dielectric layer and a gate. The gate is substantially formed between the source and the drain. The surface of the gate, being in contact with the dielectric layer, has a stepped surface profile, so that the channel length/width ratio can be changed due to the pressure sensed by the pressure sensor.

Abstract: A method of fabricating an active array color filter structure utilizes the difference between the surface properties of lipophilicity and lipophobicity. When inks are coated on an active array substrate, ink at the lipophobic areas on the active array substrate will be repelled naturally, so that the color filter pixels formed on the active array substrate naturally have contact vias, which facilitates the electrical coupling of pixel electrodes and switch elements. Since there is no aligning or laminating process required for the color filter substrate and the active array substrate during fabrication, no aligning errors will occur. Also, because the pixel electrode can extend to cover over the corresponding switch element, aggravation of the switch element is reduced.

Abstract: An Inkjet apparatus is provided. An Inkjet apparatus includes a piezoelectric inkjet print head, a plurality of driving unit, a detection unit and a control unit. The piezoelectric inkjet print head comprises a plurality of nozzles, wherein each the nozzle outputs an ink drop according to a driving voltage. The driving unit generates the driving voltage according to a control signal. The detection unit detects a state of the ink drop corresponding to the nozzle to generate a detection signal. The control unit generates the control signal to control the driving voltage according to the detection signal.