Patents by Inventor Yu-Hao Pan
Yu-Hao Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11858089Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.Type: GrantFiled: October 16, 2019Date of Patent: January 2, 2024Assignee: IV Technologies CO., Ltd.Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
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Patent number: 10828745Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.Type: GrantFiled: January 12, 2018Date of Patent: November 10, 2020Assignee: IV Technologies CO., Ltd.Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
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Publication number: 20200047307Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.Type: ApplicationFiled: October 16, 2019Publication date: February 13, 2020Applicant: IV Technologies CO., Ltd.Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
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Patent number: 10478940Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.Type: GrantFiled: June 28, 2017Date of Patent: November 19, 2019Assignee: IV Technologies CO., Ltd.Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
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Patent number: 10421173Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.Type: GrantFiled: May 18, 2017Date of Patent: September 24, 2019Assignee: IV Technologies CO., Ltd.Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
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Publication number: 20180200864Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.Type: ApplicationFiled: January 12, 2018Publication date: July 19, 2018Applicant: IV Technologies CO., Ltd.Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
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Patent number: 9969049Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.Type: GrantFiled: June 8, 2016Date of Patent: May 15, 2018Assignee: IV Technologies CO., Ltd.Inventors: Kun-Che Pai, Yu-Hao Pan
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Publication number: 20180009080Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.Type: ApplicationFiled: June 28, 2017Publication date: January 11, 2018Applicant: IV Technologies CO., Ltd.Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
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Publication number: 20170334033Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.Type: ApplicationFiled: May 18, 2017Publication date: November 23, 2017Applicant: IV Technologies CO., Ltd.Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
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Publication number: 20160375546Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.Type: ApplicationFiled: June 8, 2016Publication date: December 29, 2016Inventors: Kun-Che Pai, Yu-Hao Pan