Patents by Inventor Yu-Hao Pan

Yu-Hao Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11858089
    Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: January 2, 2024
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 10828745
    Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 10, 2020
    Assignee: IV Technologies CO., Ltd.
    Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
  • Publication number: 20200047307
    Abstract: A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 10478940
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: November 19, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Patent number: 10421173
    Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: September 24, 2019
    Assignee: IV Technologies CO., Ltd.
    Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
  • Publication number: 20180200864
    Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 19, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
  • Patent number: 9969049
    Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: May 15, 2018
    Assignee: IV Technologies CO., Ltd.
    Inventors: Kun-Che Pai, Yu-Hao Pan
  • Publication number: 20180009080
    Abstract: A manufacturing method of a polishing layer is provided. First, a mold for which the mold cavity has a contour pattern is provided, and the cross section of the contour pattern along a direction includes a plurality of recessions and at least one concavity portion, wherein the at least one concavity portion is disposed on the bottom of at least one of the recessions. A polymer material is disposed in the mold cavity. The polymer material is cured to form a semifinished product, wherein the cross section of the semifinished product along the direction includes a plurality of polishing portions corresponding to the recessions and at least one protruding portion corresponding to the at least one concavity portion. A flattening process is performed on the semifinished product to remove the at least one protruding portion.
    Type: Application
    Filed: June 28, 2017
    Publication date: January 11, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Yu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
  • Publication number: 20170334033
    Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 23, 2017
    Applicant: IV Technologies CO., Ltd.
    Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
  • Publication number: 20160375546
    Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.
    Type: Application
    Filed: June 8, 2016
    Publication date: December 29, 2016
    Inventors: Kun-Che Pai, Yu-Hao Pan