Patents by Inventor Yuhei EBATA

Yuhei EBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11807926
    Abstract: [Object] To improve both abrasion resistance and seizure resistance. [Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 ?m and a second inorganic compound having an average particle size of 4.0 to 20.0 ?m, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: November 7, 2023
    Assignee: TAIHO KOGYO CO., LTD.
    Inventor: Yuhei Ebata
  • Publication number: 20220298603
    Abstract: [Object] To improve both abrasion resistance and seizure resistance. [Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 ?m and a second inorganic compound having an average particle size of 4.0 to 20.0 ?m, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.
    Type: Application
    Filed: October 14, 2020
    Publication date: September 22, 2022
    Applicant: TAIHO KOGYO CO., LTD.
    Inventor: Yuhei EBATA
  • Publication number: 20170350449
    Abstract: There are provided a copper alloy for a slide bearing and a slide bearing, which can prevent Mn—Si primary crystals from causing seizure. The copper alloy for a slide bearing and a slide bearing according to the present invention contain 25 wt % or more and 48 wt % or less of Zn, 1 wt % or more and 7 wt % or less of Mn, 0.5 wt % or more and 3 wt % or less of Si, and 1 wt % or more and 10 wt % or less of Bi, the balance consisting of inevitable impurities and Cu, wherein there exist, in a sliding surface on which a counter material slides, Bi particles having a circle equivalent diameter larger than the average circle equivalent diameter of Mn—Si primary crystals and Bi particles having a circle equivalent diameter smaller than the average circle equivalent diameter of the Mn—Si primary crystals.
    Type: Application
    Filed: November 9, 2015
    Publication date: December 7, 2017
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Shinji MATSUMOTO, Yuhei EBATA
  • Publication number: 20170321302
    Abstract: There are provided a copper alloy for a bearing and a bearing, which can prevent seizure in Mn-Si primary crystals. The copper alloy for a bearing and the bearing according to the present invention contain 25 wt % or more and 48 wt % or less of Zn, 1 wt % or more and 7 wt % or less of Mn, 0.5 wt % or more and 3 wt % or less of Si, and 1 wt % or more and 10 wt % or less of Bi, the balance consisting of inevitable impurities and Cu, and are characterized in that, in a sliding surface on which a counter material slides, the proportion of triangles having an area of 5000 ?m2 or more and including no Bi particle with a circle equivalent diameter of 10 ?m or more, among triangles having the closest three Mn-Si primary crystals as apices, is 20 % or less.
    Type: Application
    Filed: November 9, 2015
    Publication date: November 9, 2017
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Yuhei EBATA, Shinji MATSUMOTO
  • Publication number: 20170314098
    Abstract: There are provided a copper alloy for a bearing and a bearing in which a Mn—Si compound is prevented from being broken and becoming a foreign matter. The copper alloy for a bearing and the bearing according to the present invention contain 25 wt % or more and 48 wt % or less of Zn, 1 wt % or more and 7 wt % or less of Mn, 0.5 wt % or more and 3 wt % or less of Si and 1 wt % or more and 10 wt % or less of Bi, the balance consisting of inevitable impurities and Cu, and are characterized in that the average width value among Mn—Si primary crystal particles dispersed in a sliding surface on which a counter shaft slides is 3 ?m or more.
    Type: Application
    Filed: November 4, 2015
    Publication date: November 2, 2017
    Applicant: TAIHO KOGYO Co., Ltd.
    Inventors: Yuhei EBATA, Shinji MATSUMOTO