Patents by Inventor Yuhei Oogami

Yuhei Oogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11814717
    Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: November 14, 2023
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yohei Kaneko, Yuhei Oogami, Katsuhisa Tanabe, Tsuyoshi Maeda
  • Publication number: 20210310127
    Abstract: The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound; one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 7, 2021
    Inventors: Yohei Kaneko, Yuhei Oogami, Katsuhisa Tanabe, Tsuyoshi Maeda