Patents by Inventor Yuhei SASAKI

Yuhei SASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117164
    Abstract: An object of the present invention is to obtain a resin composition with favorable high-speed formability, low adhesiveness to chill rolls and guide rolls upon film forming, and excellent adhesiveness to a resin having a polar group (polar resin). The present invention relates to a resin composition including 75 to 100 parts by mass of a propylene-based polymer (A), and 0 to 25 parts by mass of a copolymer (B) of ethylene and at least one ?-olefin selected from ?-olefins having 3 to 20 carbon atoms, and satisfying prescribed requirements, provided that the sum of the (A) and the (B) is 100 parts by mass, wherein at least a part of the propylene-based polymer (A) is modified with a polar compound, and the resin composition satisfies prescribed requirements.
    Type: Application
    Filed: January 12, 2022
    Publication date: April 11, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Koya YOSHIMOTO, Takanori SASAKI, Yuhei IZAIKE
  • Patent number: 11952483
    Abstract: A resin composition including: at least one resin ingredient selected from the group made of a resin (A) having a side chain (a) containing a hydrogen-bonding cross-linking moiety with a carbonyl-containing group and/or a nitrogen-containing heterocycle and having a glass transition point of 25° C. or lower, and a resin (B) containing a hydrogen-bonding cross-linking moiety and a covalent-bonding cross-linking moiety in a side chain and having a glass transition point of 25° C. or lower, wherein both the resin (A) and the resin (B) are a reaction product of a cross-linking agent with a maleic anhydride-modified thermoplastic resin having a melting point of 68° C. to 134° C. and a maleation rate of 0.5 to 2.5% by mass.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 9, 2024
    Assignee: ENEOS CORPORATION
    Inventors: Keisuke Chino, Yoshihiro Morinaga, Yuhei Sasaki, Takafumi Ishii, Toshiyuki Iwasaki
  • Publication number: 20210371635
    Abstract: A resin composition including: at least one resin ingredient selected from the group made of a resin (A) having a side chain (a) containing a hydrogen-bonding cross-linking moiety with a carbonyl-containing group and/or a nitrogen-containing heterocycle and having a glass transition point of 25° C. or lower, and a resin (B) containing a hydrogen-bonding cross-linking moiety and a covalent-bonding cross-linking moiety in a side chain and having a glass transition point of 25° C. or lower, wherein both the resin (A) and the resin (B) are a reaction product of a cross-linking agent with a maleic anhydride-modified thermoplastic resin having a melting point of 68° C. to 134° C. and a maleation rate of 0.5 to 2.5% by mass.
    Type: Application
    Filed: July 30, 2019
    Publication date: December 2, 2021
    Applicant: ENEOS CORPORATION
    Inventors: Keisuke CHINO, Yoshihiro MORINAGA, Yuhei SASAKI, Takafumi ISHII, Toshiyuki IWASAKI