Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a resistor structure overlying a semiconductor substrate. A dielectric structure overlies the semiconductor substrate. The resistor structure is disposed within the dielectric structure. The resistor structure includes a thin film resistor (TFR) layer and a first capping structure disposed on the TFR layer. A first cavity is disposed within the dielectric structure and abuts a first sidewall of the first capping structure.

Abstract: A chemical mechanical polishing device is provided according to some embodiments. The chemical mechanical polishing device comprises a polishing pad. The polishing pad includes a plurality of stacks of first pad fractions and a plurality of stacks of second pad fractions. The first pad fractions and the second pad fractions have different hardness. The stacks of first pad fractions and the stacks of the second pad fractions are arranged with a pattern corresponding to a predetermined feature of a structure to be polished by the chemical mechanical polishing device. The predetermined feature may include a surface profile or a material of the structure to be polished.

Abstract: Some implementations described herein include a semiconductor device including a semiconductor resistor structure having and techniques for forming the semiconductor resistor structure. The techniques include forming a layer of a silicon chromium material having different silicon/chromium ratios within the layer (e.g., a graded resistive layer) as part of forming the semiconductor resistor structure. The graded resistive layer may compensate for semiconductor manufacturing processes (e.g., etching, oxidation, thermal annealing) that may lead to film damage, thinning, crystallization, or composition drift of the graded resistive layer to enlarge process windows for fabricating the semiconductor resistor structure. The enlarged process window may improve a performance of the semiconductor resistor structure (e.g., a resistance and/or an impedance uniformity) relative to another semiconductor resistor structure fabricated using a uniform layer of a silicon chromium material.

Abstract: Some implementations described herein include techniques and apparatus for forming a semiconductor device including a semiconductor resistor structure. The semiconductor resistor structure (e.g., a low-impedance thin-film resistor structure) may include a resistive layer having an approximately rectangular shape (e.g., a width-to-length ratio that is less than approximately one). The semiconductor resistor structure includes contact structures connected to the resistive layer, a conductive bus structure having an approximately rectangular shape that connects to the contact structures, and an electrical terminal (e.g., a routing pin) centrally located at or near an edge of the conductive bus structure.

Abstract: Disclosed herein are electrospun fibrous matrix and its production method. The method mainly includes the steps of, mixing a first polymer and a drug to form a first mixture, and sonicating the first mixture until a plurality of microparticles are formed with the drug encapsulated therein; and mixing the plurality of microparticles with a second polymer to form a second mixture, subjecting the second mixture to a wet electrospinning process to form the electrospun fibrous matrix. The thus-produced electrospun fibrous matrix is characterized by having a plurality of first and second fibrils woven together, in which each second fibril has a plurality of drug-encapsulated microparticles independently integrated and disposed along the longitudinal direction of the second fibril. Also disclosed herein is a method for treating a wound of a subject. The method includes applying the present electrospun fibrous matrix to the wound of the subject.

Abstract: A method of generating randomness by public participation may comprise: communicating with the commodity devices to execute a protocol comprising a setup phase, a contribution phase and a result-generation phase, wherein: in the setup phase, parameters are initialized, a verifiable delay function is setup, and the parameters are published; the contribution phase is divided into at least one first stage, published parameters are provided, random values are received, and a Merkle tree root and Merkle tree audit paths are published in each of the first stage; and the result-generation phase is divided into at least one second stage of the same number as that of the first stage, each second stage is dedicated to one of the first stage ahead of the second stage for a period, and in each second stage, computation is performed to generate a result of randomness which is published.

Abstract: An electronic device includes a substrate; a first electrode layer disposed on the substrate; a first insulating layer disposed on the first electrode layer, having a first opening to expose a surface of the first electrode layer; a connecting layer, wherein at least a portion of the connecting layer is disposed in the first opening, a sidewall exposure of the first opening is exposed, and the connecting layer is electrically connected to the first electrode layer; a second insulating layer disposed on the first insulating layer, having a second opening to expose a surface of the connecting layer; and a second electrode layer disposed on the second insulating layer, wherein at least a portion of the second electrode layer is disposed in the second opening, and is electrically connected to the connecting layer.

Abstract: An optical fingerprint identification structure is provided, including: a protective glass and an optical fingerprint identification module, wherein the optical fingerprint identification module is located under the protective glass. The protective glass of the present invention is of a thickness. The gap between the protective glass and the optical fingerprint identification module is an air gap. The optical fingerprint identification module further comprises: a receiving lens assembly, an image sensor module, a module housing, and a module housing extension, the receiving lens assembly is located at the top of the optical fingerprint identification module, that is, close to the air gap, and the image sensor module is located below the receiving lens assembly. As such, the size of the optical fingerprint identification structure is reduced, and is applicable to the side of device, so that the usable area on the front and back of the device is increased.

Abstract: A head-mounted display and an imaging apparatus for displaying image thereof are provided. The imaging apparatus includes a first display, a second display, and a first focus adjusting apparatus. The first display generates a first sub-image; wherein the first sub-image is located on a first imaging plane, and is then projected to the target system. The second display generates a second sub-image; wherein the second sub-image is located on a second imaging plane, and is then projected to the target system. The first focus adjusting apparatus is in front of the second display, and is used to adjust the position of the second imaging plane. The first imaging surface and a second imaging surface are overlapped or non-overlapped.

Abstract: A head mounted display and a multiple depth imaging apparatus thereof are provided. The imaging apparatus includes a beam splitting device, a first display, a second display, a third display and a lens set. The beam splitting device has a first reflective surface, a second reflective surface and a transmissive surface. The first display projects a first image to the first reflective surface. The second display projects a second image to the transmissive surface. The third display projects a third image to the second reflective surface. The lens set is disposed between the beam splitting device and a target area. The first image, second image and third image are respectively imaging on a first imaging surface, a second imaging surface and a third imaging surface, and distances between the target area and the first, second and third imaging surfaces are different.

Abstract: A head mounted display device and a backlight apparatus are provided. The backlight apparatus is adapted for the head mounted display device. The backlight apparatus includes a light guiding component, a light source, and a prism structure. The light source is disposed on a side of the light guiding component. The prism structure has a first surface adjacent to a first surface of the light guiding component. There are a plurality of convex pyramids on the first surface of the prism structure. The pyramids are arranged in an array.

Abstract: A head mounted display and a multiple depth imaging apparatus thereof are provided. The imaging apparatus includes a beam splitting device, a first display, a second display, a third display and a lens set. The beam splitting device has a first reflective surface, a second reflective surface and a transmissive surface. The first display projects a first image to the first reflective surface. The second display projects a second image to the transmissive surface. The third display projects a third image to the second reflective surface. The lens set is disposed between the beam splitting device and a target area. The first image, second image and third image are respectively imaging on a first imaging surface, a second imaging surface and a third imaging surface, and distances between the target area and the first, second and third imaging surfaces are different.

Abstract: A head-mounted display and an imaging apparatus for displaying image thereof are provided. The imaging apparatus includes a first display, a second display, and a first focus adjusting apparatus. The first display generates a first sub-image; wherein the first sub-image is located on a first imaging plane, and is then projected to the target system. The second display generates a second sub-image; wherein the second sub-image is located on a second imaging plane, and is then projected to the target system. The first focus adjusting apparatus is in front of the second display, and is used to adjust the position of the second imaging plane. The first imaging surface and a second imaging surface are overlapped or non-overlapped.

Abstract: Disclosed is a touch panel including a substrate with a touch sensing region and a non-touch sensing region, wherein the non-touch sensing region surrounds the touch sensing region. A plurality of sensing electrodes are disposed on the touch sensing region. A plurality of metal traces are disposed on the non-touch sensing region and electrically connected to the sensing electrodes. A passivation layer covers the metal trace, wherein a distance between an edge of the passivation layer and the metal traces is greater than or equal to at least 140 micrometers.

Abstract: A device and method are provided for automatically adjusting gain, including a conversion module for converting an audio time-domain signal to an audio frequency-domain signal, an analysis module for analyzing the audio frequency-domain signal in accordance with an equal-loudness level contour of human hearing so as to generate strength weightings and generating a signal strength in accordance with the weightings, a calculation module for calculating a gain by analysis of the audio frequency-domain signal when the signal strength falls outside a default range, and a control module for generating an audio output signal in accordance with the gain and the audio time-domain signal.

Abstract: A device and method are provided for automatically adjusting gain, including a conversion module for converting an audio time-domain signal to an audio frequency-domain signal, an analysis module for analyzing the audio frequency-domain signal in accordance with an equal-loudness level contour of human hearing so as to generate strength weightings and generating a signal strength in accordance with the weightings, a calculation module for calculating a gain by analysis of the audio frequency-domain signal when the signal strength falls outside a default range, and a control module for generating an audio output signal in accordance with the gain and the audio time-domain signal.

Abstract: A handsaw includes a handle, a blade removably mounted on the handle, and a press button pivotally mounted on the handle and detachably engaged with the blade to lock the blade on the handle and unlock the blade from the handle. Thus, the blade can be detached from the handle easily and rapidly by pressing the pressing portion of the press button, thereby facilitating the user replacing the blade. In addition, the concave face of the blade is rested on the convex face of the handle, so that the blade is supported by the handle rigidly and stably, thereby facilitating a user operating the handsaw.

Abstract: A handsaw includes a handle, a blade, and a locking member. Thus, the user only needs to drive the drive lever of the locking member to detach the snapping hook of the locking member from the snapping groove of the handle so as to detach the blade from the handle, so that the blade is detached from the handle easily, rapidly and conveniently, thereby facilitating the user mounting and replacing the blade.