Abstract: In an exposure apparatus of a liquid immersion exposure method, there is a case when a wafer table holding a wafer moves, a liquid immersion area formed by liquid supplied in a space between a wafer table and a projection optical system passes over a head mounted on the wafer table. Therefore, for a head over which the liquid immersion area has passed, the residual presence of the liquid is detected based on an amount of light of a reflected light received by the light receiving element which receives the reflected light from the wafer table surface. And, of a plurality of heads, positional information of the wafer table is measured, based on measurement values of a head that had no liquid remaining in the detection.

Abstract: On the +X and ?X sides of a projection unit, a plurality of Y heads are arranged in parallel to the X-axis by a predetermined distance half or less than half the effective width of the scale, so that two heads each constantly form a pair and face a pair of Y scales. Similarly, on the +Y and ?Y sides of the projection unit, a plurality of X heads are arranged in parallel to the Y-axis by the predetermined distance described above, so that two heads each constantly form a pair and face a pair of X scales. Of the pair of heads consisting of two heads which simultaneously face the scale, measurement values of a priority head is used, and when abnormality occurs in the measurement values of the priority head due to malfunction of the head, measurement values of the other head is used. Then, by using the measurement values of the two pairs of Y heads and the pair of X heads, a position of a stage within a two-dimensional plane is measured in a stable manner and with high precision.

Abstract: On the +X and ?X sides of a projection unit, a plurality of Z heads are arranged in parallel to the X-axis, by a distance half or less than half the effective width of the Y scale so that two Z heads each constantly form a pair and face a pair of Y scales. Of the pair of heads consisting of two Z heads which simultaneously face the scale, measurement values of a priority head is used, and when abnormality occurs in the measurement values of the priority head due to dust and the like adhering on the scale surface, measurement values of the other head is used, and the positional information of the stage in at least the Z-axis direction is measured in a stable manner and with high precision.

Abstract: On the +X and ?X sides of a projection unit, a plurality of Y heads are arranged in parallel to the X-axis by a distance half or less than half the effective width of the scale, so that two heads each constantly form a pair and face a pair of Y scales. Similarly, on the +Y and ?Y sides of the projection unit, a plurality of X heads are arranged in parallel to the Y-axis by the distance, so that two heads each constantly form a pair and face a pair of X scales. Of the pair of heads consisting of two heads which simultaneously face the scaler measurement values of a priority head is used, and when abnormality occurs in the measurement values of the priority head due to dust and the like adhering on the scale surface, measurement values of the other head is used. By using the two pairs of Y heads and the pair of X heads, a position of a stage within a two-dimensional plane is measured in a stable manner and with high precision.

Abstract: On the +X and ?X sides of a projection unit, a plurality of Z heads are arranged in parallel to the X-axis, by a predetermined distance half or less than half the effective width of the Y scale so that two Z heads each constantly form a pair and face a pair of Y scales. Of the pair of heads consisting of two Z heads which simultaneously face the scale, measurement values of a priority head is used, and when abnormality occurs in the measurement values of the priority head due to malfunction of the head, measurement values of the other head is used, and the positional information of the stage in at least the Z-axis direction can be measured in a stable manner and with high precision.

Abstract: A first positional information of a wafer stage is measured using an interferometer system such as, for example, a Z interferometer. At the same time, a second positional information of the wafer stage is measured using a surface position measurement system such as, for example, two Z heads. Moving average is applied to a difference between the first positional information and the second positional information for a predetermined measurement time to set a coordinate offset, and the coordinate offset is used to inspect the reliability of output signals of the surface position measurement system. When the output signals are confirmed to be normal, servo control of the wafer stage is performed using a sum of the first positional information and the coordinate offset. According to the servo control by this hybrid method, drive control of the wafer stage which has the stability of the interferometer and the precision of the Z heads becomes possible.

Abstract: A controller uses two Z heads, which are positioned above a reflection surface installed on the ±X ends of the upper surf ace of a table, to measure the height and tilt of the table. According to the XY position of the table, the Z heads to be used are switched from ZsR and ZsL to ZsR? and ZsL. On the switching of the heads, the controller applies a coordinate linkage method to set an initial value of the Z heads which are to be newly used. Accordingly, although the Z heads to be used are sequentially switched according the XY position of the table, measurement results of the height and the tilt of the table are stored before and after the switching, and it becomes possible to drive the table with high precision.

Abstract: A first grating is placed on the upper surface of wafer stage WST, and on the +Y side of the first grating, a calibration area is arranged where an auxiliary grating is formed. By performing a predetermined calibration process using the calibration area, such as calibration process related to position measurement of the wafer stage using a head and the like of an encoder, it becomes possible to perform position control of the wafer stage in the predetermined direction with good precision using the encoder after the calibration process.

Abstract: A controller uses two Z heads, which are positioned above a reflection surface installed on the ±X ends of the upper surface of a wafer table, to measure the height and tilt of the wafer table. The Z head to be used is switched according to XY positions of the wafer table. On the switching of the heads, the controller applies a coordinate linkage method to set an initial value of the Z head which is to be newly used. Accordingly, although the Z head to be used is sequentially switched according the XY position of the wafer table, measurement results of the height and the tilt of the wafer table are stored before and after the switching, and it becomes possible to drive the wafer table with high precision.

Abstract: Positional information of a wafer stage in a Z-axis direction and a tilt direction with respect to the XY plane (for example, a ?y direction) is measured, using a surface position measurement system, such as, for example, a Z head and the like, and the wafer stage is driven based on the measurement results. At the same time, positional information of the wafer stage is measured using an interferometer system such as, for example, a Z interferometer. When abnormality of the surface position measurement system is detected or when the wafer stage moves off from a measurement area of the surface position measurement system, drive control is switched to a drive control based on the measurement results of the interferometer system. Accordingly, the wafer stage can be driven continuously even at the time of abnormality generation in the surface position measurement system.

Abstract: By moving a wafer stage while monitoring an XY position of a wafer stage WST using an interferometer system, and scanning a Y scale in an X-axis direction and a Y-axis direction using a surface position sensor, an XY setting position of the surface position sensor is measured. Based on information of the setting position obtained, by measuring a position coordinate of the wafer stage in a perpendicular direction with respect to an XY plane and a tilt direction, the wafer stage is driven in a stable manner and with high precision.

Abstract: A wafer stage is moved while monitoring a position using an X interferometer and a Y interferometer, and a Z position of a Y scale arranged on the wafer stage upper surface is measured using a surface position sensor. In this case, for example, from a difference of measurement results of two surface position sensors, tilt of the Y scale in the Y-axis direction is obtained. By measuring the tilt of the entire surface of a pair of Y scales, two-dimensional unevenness data of the scales are made. By correcting the measurement results of the position surface sensor using the unevenness data, and then using the corrected measurement results, it becomes possible to drive wafer stage WST two-dimensionally with high precision.

Abstract: First positional information of a stage is measured using an interferometer system, for example, an X interferometer and a Y interferometer. At the same time, second positional information of the stage is measured using an encoder system, for example, one X head and one Y head. A coordinate offset is set by performing a moving average of the difference between the first positional information and the second positional information for over a predetermined measurement time, and the reliability of output signals of the encoder system is verified using the coordinate offset. In the case the output signals are determined to be normal, the stage is servocontrolled using the sum of the first positional information and the coordinate offset. Such servocontrol by a hybrid method makes it possible to perform drive control of the stage having stability of the interferometer and accuracy of the encoder together.

Abstract: Positional information of a movement plane of a wafer stage is measured using an encoder system such as, for example, an X head and a Y head, and the wafer stage is controlled based on the measurement results. At the same time, positional information of the wafer stage is measured using an interferometer system such as, for example, an X interferometer and a Y interferometer. When abnormality of the encoder system is detected or when the wafer stage moves off from a measurement area of the encoder system, drive control is switched to a drive control based on the measurement results of the interferometer system. Accordingly, drive control of the wafer stage can be performed continuously in the entire stroke area, even at the time when abnormality occurs in the encoder system.

Abstract: By irradiating a detection beam from an irradiation system of a detection device to a scale used for measuring the position of a wafer stage, and detecting the detection beam via the scale by a photodetection system, a surface state (an existence state of foreign substance) of the scale is detected. With this operation, detection of the surface state can be performed contactlessly with respect to the scale. Moreover, movement control of the wafer stage can be performed with high precision by taking the surface state into consideration.

Abstract: Positional information (an estimate value in which a linear component of positional deviation amount is corrected) of each shot on a wafer is calculated by a statistical computation using actual measurement values of positional information of a plurality of sample shots on the wafer (step 488). And, a variation amount of a non-linear component of positional deviation amount is calculated at predetermined intervals with respect to each of a plurality of measurement shots including the sample shots (step 496), and judgment is made about the necessity of update of correction information based on magnitude of the calculated variation amount of a non-linear component of each measurement shot area (step 498). Therefore, comparing with the case when actual values of positional information of all shots on the wafer are obtained at least once in each lot in order to update a correction value, the number of shots subject to positional information measurement and the measurement time can be reduced without fail.

Abstract: An exposure apparatus includes a substrate stage movable while holding a substrate, a substrate alignment system which detects an alignment mark (1) on the substrate held by the substrate stage and detects a reference mark (PFM) provided on the substrate stage, and a mask alignment system which detects, via a projection optical system, a reference mark (MFM) provided on the substrate stage. The reference mark (PFM) on the substrate stage is detected without a liquid by using the substrate alignment system, and the reference mark (MFM) on the substrate stage is detected using the mask alignment system via the projection optical system and the liquid. Then, a positional relationship between a detection reference position of the substrate alignment system and a projection position of an image of a pattern is obtained, thereby accurately performing alignment processing in the liquid immersion exposure.