Patents by Inventor Yuhshi Lu

Yuhshi Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
    Patent number: 7671114
    Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: March 2, 2010
    Assignee: Henkel Corporation
    Inventors: John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk, Andrew D. Messana