Abstract: The present disclosure discloses a Bluetooth communication system. A first access point apparatus of a Bluetooth access point apparatus performs periodic broadcast communication.

Abstract: The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier; and a fluorescent sheet covering the light-emitting diode chip, wherein the fluorescent sheet has a recess corresponding to the light-emitting diode chip, wherein the light-emitting diode chip is placed in the recess, and light-emitting surfaces of the light-emitting diode chip are covered by the fluorescent sheet. The present disclosure also provides a method for manufacturing a light-emitting diode package.

Abstract: A solid-state light-emitting module includes a transparent substrate, a light emitting diode chip, a first package sealant, a second package sealant, and a wavelength selection structure layer. The transparent substrate includes a first surface, a second surface which is opposite to the first surface, and a side face surrounding and connecting the first surface and the second surface. The light emitting diode chip is fixed on the first surface to emit light with a first wavelength. The first package sealant is disposed on the first surface to cover the light emitting diode chip. The second package sealant is disposed on the second surface and opposite to the first package sealant. The wavelength selection structure layer is disposed on the side face of the transparent substrate for selectively reflecting or transmitting the light therethrough.

Abstract: A light emitting diode package includes a lead frame, a light emitting diode chip, a wavelength conversion structure, and a filter. The light emitting diode chip is disposed on and electrically connected to the lead frame for providing a first light beam with a first wavelength. The light emitting diode chip is configured to provide a first light beam with a first wavelength. The wavelength conversion structure is disposed on the light emitting diode chip, and is configured to convert the first light beam into a second light beam with a second wavelength. The filter is disposed between the light emitting diode chip and the wavelength conversion structure. The filter allows the first light beam from the light emitting diode chip to pass therethrough to enter the wavelength conversion structure, and reflects the second light beam from the wavelength conversion structure back to the wavelength conversion structure.