Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: A manufacturing method includes: a step of forming a light-emitting element layer by forming a semiconductor layer, a light-emitting layer, and a semiconductor layer in this order from a side with a first substrate on a surface, of the first substrate, on one side; a step of forming a separation trench in the light-emitting element layer to form a plurality of island shape light-emitting element layers; a step of forming a light shielding layer made of a material different from a material of the light-emitting element layer, in the separation trench; and a step of forming a plurality of light-emitting elements each including a corresponding one of the plurality of island shape light-emitting element layers having a height less than a height of the light shielding layer by etching a portion of the semiconductor layers of each of the plurality of island shape light-emitting element layers.

Abstract: A semiconductor module includes a base substrate; a plurality of light emitting elements; a plurality of color conversion layers being in contact with each upper portion of the plurality of light emitting elements adjacent to each other; and a light shielding layer disposed between the plurality of light emitting elements adjacent each other and between the color conversion layers adjacent to each other, and separating the plurality of light emitting elements and a plurality of color conversion layers.

Abstract: A light source device includes a plurality of light emitting elements, phosphor layers provided for each of the plurality of light emitting elements at positions on emission sides of light from the light emitting elements and parts of which are in contact with the light emitting elements, light shielding layers different from the phosphor layers, and reinforcement layers provided between the light emitting elements.

Abstract: Provided is a light source device including: at least one light emitting element of at least one type; at least one far-red phosphor that, when excited by output light from the light emitting element, emits light having a peak in a wavelength range of 680 nm or more to less than 780 nm; and at least one phosphor that, when excited by the output light from the light emitting element, emits light having a peak in a wavelength range different from the wavelength range of the light emitted from the far-red phosphor. The spectrum of light emitted from the light source device has characteristic A below. This light source device has sufficient emission intensity over the entire visible range, i.e., over a wavelength range of from 400 nm to 750 nm inclusive. Characteristic A: The ratio of a minimum emission intensity to a maximum emission intensity in a wavelength range of from 400 nm to 750 nm inclusive is 20% or more.

Abstract: Provided is a light source device including: at least one light emitting element of at least one type; at least one far-red phosphor that, when excited by output light from the light emitting element, emits light having a peak in a wavelength range of 680 nm or more to less than 780 nm; and at least one phosphor that, when excited by the output light from the light emitting element, emits light having a peak in a wavelength range different from the wavelength range of the light emitted from the far-red phosphor. The spectrum of light emitted from the light source device has characteristic A below. This light source device has sufficient emission intensity over the entire visible range, i.e., over a wavelength range of from 400 nm to 750 nm inclusive. Characteristic A: The ratio of a minimum emission intensity to a maximum emission intensity in a wavelength range of from 400 nm to 750 nm inclusive is 20% or more.

Abstract: A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).

Abstract: A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

Abstract: In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.

Abstract: The device bends readily and safely without a sealing resin peeling off or a breakage in a wire. In an LED columnar light emitting device 1 in which a plurality of two conductive regions 2 and 3 corresponding to the ± polarities are provided in the columnar direction on a film wiring board, each light emitting element is connected to and installed on the plurality of two conductive regions 2 and 3, and each LED chip 6, as each light emitting element, is sealed above with a transparent sealing resin 8, notch sections 9 and 9A are formed on both outer sides of two plated lines 4 as opening sections between the two conductive regions 2 and 3 and another two conductive regions 2 and 3 adjacent thereto in the columnar direction.

Abstract: The folding along the disposed direction of wiring patterns is prevented. Concave-convex shapes in a plan view for preventing the folding of a device as step portions in a plan view are provided on opposing sides of two conductive regions. A front edge side 3a1 of a convex shape in a plan view of a Cu foil layer 3a, which is one of the two conductive regions, is disposed to enter into a concave portion (on the side of a bottom side 3b2) of a concave shape in a plan view of a Cu foil layer 3b, which is the other conductive region, to prevent the folding along the disposed direction of wiring patterns.

Abstract: A high heat dissipation effect and a high light utilization efficiency are realized. A substrate for a light emitting device includes an aluminum substrate (1), a high heat dissipation ceramic layer (2) disposed on the aluminum substrate (1), an etching frame (3) disposed on the high heat dissipation ceramic layer (2), and a highly reflective ceramic layer (4) disposed on the high heat dissipation ceramic layer (2) and the etching frame (3).

Abstract: A surface mounted light emitting device having superior reliability with a focus on low cost producibility, in which a protective element can be formed without lowering the efficiency of light emission from a light emitting element, is provided. Since, for example, a printed resistance 16, as a protective element, is formed on at least the top surface side, the back surface side, or the inside of an insulating film 2 and, for example, the printed resistance 16, as a protective element, is formed on the rear surface side of the installation surface of a light emitting element 11, light emitted from the light emitting element 11 is not obstructed due to light blocking, light absorption or the like by, for example, the printed resistance 16, as a protective element.

Abstract: A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).

Abstract: A reflector (10) according to one aspect of the present invention includes a metal reflector base (3) having a three-dimensional surface, and a ceramic layer (4) having optical reflectivity, which is formed on the three-dimensional surface.

Abstract: A first land portion (2f) or a second land portion (2s) is formed on a board (1), and a first connector (20b) or a second connector (20s) is electrically connected while the first connector (20b) or the second connector (20s) is placed on the first land portion (2f) or the second land portion (2s).

Abstract: In a light-emitting device (30), a wiring pattern including conductor wirings (160, 165) and electrodes (170, 180) is formed on a substrate (110), and an Au layer (120) is formed on the wiring pattern.

Abstract: A light-emitting apparatus has a substrate (72) having a generally disc shape, a light-emitting part (76) having a plurality of LED chips (73) mounted on one main surface of the substrate (72), the plurality of LED chips (73) being sealed with a resin (74), and a heat-sink attachment part having a heat-sink attachment male thread (80) formed on a side surface of the substrate (72). When the attachment area of the substrate (72) to the heat sink is kept the same, the light-emitting part (76) may be enlarged, and when the light-emitting unit (76) is kept the same, the attachment area of the substrate (72) may be reduced.

Abstract: The device bends readily and safely without a sealing resin peeling off or a breakage in a wire. In an LED columnar light emitting device 1 in which a plurality of two conductive regions 2 and 3 corresponding to the ± polarities are provided in the columnar direction on a film wiring board, each light emitting element is connected to and installed on the plurality of two conductive regions 2 and 3, and each LED chip 6, as each light emitting element, is sealed above with a transparent sealing resin 8, notch sections 9 and 9A are formed on both outer sides of two plated lines 4 as opening sections between the two conductive regions 2 and 3 and another two conductive regions 2 and 3 adjacent thereto in the columnar direction.

Abstract: Concave-convex shapes in a plan view for preventing the folding of a device as step portions in a plan view are provided on opposing sides of two conductive regions. A front edge side 3a1 of a convex shape in a plan view of a Cu foil layer 3a, which is one of the two conductive regions, is disposed to enter into a concave portion (on the side of a bottom side 3b2) of a concave shape in a plan view of a Cu foil layer 3b, which is the other conductive region, to prevent the folding along the disposed direction of wiring patterns.