Abstract: By increasing a pressure in a chamber flange (10) at a predetermined rate, the number of gas molecules that carry inner thermal energy is increased, which results in a uniform temperature distribution. Thus, non-melting residues of, air bubbles in, and insufficient expansion of the sealing resin (43) are reduced. After removal of the air bubbles (45), a pressure is applied between a substrate (41) and a sealing substrate (44), thereby the substrate (41), a solar cell (42), the sealing resin (43) and the sealing substrate (44) are adhered to each other.

Abstract: By increasing a pressure in a chamber flange (10) at a predetermined rate, the number of gas molecules that carry inner thermal energy is increased, which results in a uniform temperature distribution. Thus, non-melting residues of, air bubbles in, and insufficient expansion of the sealing resin (43) are reduced. After removal of the air bubbles (45), a pressure is applied between a substrate (41) and a sealing substrate (44), thereby the substrate (41), a solar cell (42), the sealing resin (43) and the sealing substrate (44) are adhered to each other.

Abstract: A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.

Abstract: A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.

Abstract: A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.

Abstract: A plasma CVD apparatus comprises an anode electrode and a cathode electrode, and is for forming a thin film on a substrate by performing plasma discharge between the anode electrode and the cathode electrode, comprising: a substrate holder disposed between the anode electrode and the cathode electrode; and one conductive member disposed between the substrate holder and one electrode of either the anode electrode or the cathode electrode, wherein the substrate holder supports the substrate, the one conductive member is provided between the one electrode and the substrate holder so as to substantially cover an entire space between the one electrode and the substrate holder, and the one conductive member is electrically connected to the one electrode and the substrate holder.