Abstract: A system and a method for testing a high-speed ADC in a DP-QPSK receiver are disclosed. The system includes a simulation module for outputting a data flow and performing signal recovery, an arbitrary waveform generator for receiving the data flow and outputting a high-speed analog signal and a clock signal, a high-speed ADC for converting the high-speed analog signal and the clock signal into a high-speed digital signal, a cache memory circuit for converting the high-speed digital signal into a low-speed digital signal, and a logic analyzer for sending the low-speed digital signal to the simulation module.

Abstract: The present disclosure discloses a full adder based on resistive-switching devices and an operation method thereof. A multi-bit full adder circuit is constituted by using a cross-bar array of resistive-switching devices, wherein data of standard sums is stored on the principle diagonal of the cross-bar array in a nonvolatile manner, and carry data is stored in adjacent units on both sides of the principle diagonal. The carry data is stored according to whether the storage loop (crosstalk loop) is turned on. With the present disclosure, the multi-bit full adder circuit is significantly simplified. Thereby, additional circuits for generating a carry signal are reduced, the circuit delay and chip area are decreased, and the adder has an ability of nonvolatile storage.

Abstract: The present disclosure discloses a full adder based on resistive-switching devices and an operation method thereof. A multi-bit full adder circuit is constituted by using a cross-bar array of resistive-switching devices, wherein data of standard sums is stored on the principle diagonal of the cross-bar array in a nonvolatile manner, and carry data is stored in adjacent units on both sides of the principle diagonal. The carry data is stored according to whether the storage loop (crosstalk loop) is turned on. With the present disclosure, the multi-bit full adder circuit is significantly simplified. Thereby, additional circuits for generating a carry signal are reduced, the circuit delay and chip area are decreased, and the adder has an ability of nonvolatile storage.

Abstract: According to an exemplary embodiment, an ESD protection structure situated in a semiconductor die includes a FET including a gate and first and second active regions, where the gate includes at least one gate finger, and where the at least one gate finger is situated between the first and second active regions. The ESD protection structure further includes at least one contact-via chain connected to the first active region, where the at least one contact-via chain includes a contact connected to a via. The at least one contact-via chain forms a ballast resistor for increased ESD current distribution uniformity. The contact is connected to the via by a first metal segment situated in a first interconnect metal layer of a die. The at least one contact-via chain is connected between the first active region and a second metal segment situated in a second interconnect metal layer of the die.

Abstract: According to an exemplary embodiment, an ESD protection structure situated in a semiconductor die includes a FET including a gate and first and second active regions, where the gate includes at least one gate finger, and where the at least one gate finger is situated between the first and second active regions. The ESD protection structure further includes at least one contact-via chain connected to the first active region, where the at least one contact-via chain includes a contact connected to a via. The at least one contact-via chain forms a ballast resistor for increased ESD current distribution uniformity. The contact is connected to the via by a first metal segment situated in a first interconnect metal layer of a die. The at least one contact-via chain is connected between the first active region and a second metal segment situated in a second interconnect metal layer of the die.