Patents by Inventor Yu-Huan Liu
Yu-Huan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10907095Abstract: The present invention relates to novel phosphor mixtures and to a light-emitting device which comprises at least one of the novel phosphor mixtures. The phosphor mixtures can be used in phosphor-converted LEDs with a semiconductor that emits in the violet spectral region. The present invention furthermore relates to a lighting system which may comprise the light-emitting devices according to the invention, and to a dynamic lighting system. The present invention furthermore relates to a process for the preparation of the phosphor mixtures according to the invention and to the use thereof in light-emitting devices for use in general lighting and/or in specialty lighting.Type: GrantFiled: March 5, 2018Date of Patent: February 2, 2021Assignee: LITEC-VERMOGENSVERWALTUNGSGESELLSCHAFT MBHInventors: Andreas Benker, Ralf Petry, Ingo Koehler, Irene (Yu Huan) Liu, Christof Hampel, Aleksander Zych
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Publication number: 20200010759Abstract: The present invention relates to novel phosphor mixtures and to a light-emitting device which comprises at least one of the novel phosphor mixtures. The phosphor mixtures can be used in phosphor-converted LEDs with a semiconductor that emits in the violet spectral region. The present invention furthermore relates to a lighting system which may comprise the light-emitting devices according to the invention, and to a dynamic lighting system. The present invention furthermore relates to a process for the preparation of the phosphor mixtures according to the invention and to the use thereof in light-emitting devices for use in general lighting and/or in specialty lighting.Type: ApplicationFiled: March 5, 2018Publication date: January 9, 2020Applicant: MERCK PATENT GMBHInventors: Andreas BENKER, Ralf PETRY, Ingo KOEHLER, Irene (Yu Huan) LIU, Christof HAMPEL, Aleksander ZYCH
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Patent number: 9279081Abstract: A phosphor composition and a white light emitting device using the same are disclosed. The white light emitting device includes a blue light emitting diode and a phosphor composition disposed on the blue light emitting diode, wherein the phosphor composition includes a yellow lanthanum silicon nitride, a yellow ?-SiAlON and a red CaAlSiN, and the weight proportion of the yellow lanthanum silicon nitride, the yellow ?-SiAlON and the red CaAlSiN is 1: 1:0.3˜0.45.Type: GrantFiled: July 20, 2012Date of Patent: March 8, 2016Assignee: Everlight Electronics Co., Ltd.Inventors: Yao-Yu Yang, Yu-Huan Liu
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Patent number: 8604510Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.Type: GrantFiled: October 11, 2012Date of Patent: December 10, 2013Assignee: Everlight Electronics Co., Ltd.Inventors: Ssu-Yuan Weng, Yu-Huan Liu
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Patent number: 8431948Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.Type: GrantFiled: March 7, 2012Date of Patent: April 30, 2013Assignee: Everlight Electronics Co., Ltd.Inventor: Yu-Huan Liu
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Patent number: 8389307Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.Type: GrantFiled: October 26, 2009Date of Patent: March 5, 2013Assignee: Everlight Electronics Co., Ltd.Inventor: Yu-Huan Liu
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Publication number: 20130045603Abstract: A semiconductor process is described as follows. A material layer is provided on a substrate. A low-temperature oxidation treatment is performed to the material layer. A photoresist layer is formed on the material layer after the low-temperature oxidation treatment. The photoresist layer is patterned.Type: ApplicationFiled: August 19, 2011Publication date: February 21, 2013Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chao-Yu Tsai, Chih-Chung Huang, Tsz-Yuan Chen, Kung-Hsun Tsao, Huan-Hsin Yeh, Yu-Huan Liu
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Publication number: 20130032850Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.Type: ApplicationFiled: October 11, 2012Publication date: February 7, 2013Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Ssu-Yuan Weng, Yu-Huan Liu
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Publication number: 20120168804Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.Type: ApplicationFiled: March 7, 2012Publication date: July 5, 2012Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventor: Yu-Huan Liu
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Patent number: 8154033Abstract: A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.Type: GrantFiled: December 29, 2009Date of Patent: April 10, 2012Assignee: Everlight Electronics Co., Ltd.Inventor: Yu-Huan Liu
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Patent number: 7965028Abstract: A white-light emitting device comprises a substrate, a short wavelength light source, a protective layer, a first structure, and a second structure. The short wavelength light source is disposed on the substrate for generating a first light, and the protective layer covering the short wavelength light source is pervious to the first light. The first structure is disposed on the protective layer for generating a second light, in which the first structure includes a first quantum well and a transmission layer. The second structure is disposed on the first structure for generating a third light. Finally, the first light, the second light, and the third light are mixed to generate a white light.Type: GrantFiled: April 21, 2008Date of Patent: June 21, 2011Assignee: Au Optronics CorporationInventors: Yu-Huan Liu, Chieh-Hsiu Lin, Chih-Lin Wang, Yun-Yi Tien
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Publication number: 20110121349Abstract: A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is fromed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so tat the LED chip is electrically connected to the metal circuit.Type: ApplicationFiled: May 17, 2010Publication date: May 26, 2011Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Szu-Yuan Weng, Yu-Huan Liu
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Publication number: 20100264429Abstract: A light emitting device and an electronic device using the same are provided. The light emitting device includes a light emitting chip having a wavelength between 460 nm and 650 nm and phosphor powders, in which the phosphor powders can be stimulated by light emitted from the chip to emit light with a wavelength between 700 nm and 1200 nm. The phosphor powders are selected from the group consisting of Cu-doped CdS, Cu-doped SeS, Cu-doped CdTe and combinations thereof.Type: ApplicationFiled: October 26, 2009Publication date: October 21, 2010Applicant: EVER LIGHT ELECTRONICS CO., LTD.Inventor: Yu-Huan Liu
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Publication number: 20100193816Abstract: A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.Type: ApplicationFiled: October 26, 2009Publication date: August 5, 2010Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventor: Yu-Huan Liu
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Publication number: 20100163892Abstract: A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.Type: ApplicationFiled: December 29, 2009Publication date: July 1, 2010Inventor: Yu-Huan Liu
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Patent number: 7718551Abstract: A method for forming a photoresist layer is provided. The method includes following steps. A wafer is provided in a semiconductor machine. The wafer is spun at a first spin speed. A pre-wet solvent is dispensed on the spinning wafer by using a nozzle disposed at a fixed position. The pre-wet solvent then stops dispensing. The spin speed of the wafer is adjusted from the first spin speed to a second spin speed which is faster than the first spin speed. Thereafter, a photoresist layer is coated on the wafer.Type: GrantFiled: March 7, 2008Date of Patent: May 18, 2010Assignee: United MIcroelectronics Corp.Inventors: Yu-Huan Liu, Chih-Jung Chen, Chih-Chung Huang
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Publication number: 20090227120Abstract: A method for forming a photoresist layer is provided. The method includes following steps. A wafer is provided in a semiconductor machine. The wafer is spun at a first spin speed. A pre-wet solvent is dispensed on the spinning wafer by using a nozzle disposed at a fixed position. The pre-wet solvent then stops dispensing. The spin speed of the wafer is adjusted from the first spin speed to a second spin speed which is faster than the first spin speed. Thereafter, a photoresist layer is coated on the wafer.Type: ApplicationFiled: March 7, 2008Publication date: September 10, 2009Applicant: UNITED MICROELECTRONICS CORP.Inventors: Yu-Huan Liu, Chih-Jung Chen, Chih-Chung Huang
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Publication number: 20090153024Abstract: A white-light emitting device comprises a substrate, a short wavelength light source, a protective layer, a first structure, and a second structure. The short wavelength light source is disposed on the substrate for generating a first light, and the protective layer covering the short wavelength light source is pervious to the first light. The first structure is disposed on the protective layer for generating a second light, in which the first structure includes a first quantum well and a transmission layer. The second structure is disposed on the first structure for generating a third light. Finally, the first light, the second light, and the third light are mixed to generate a white light.Type: ApplicationFiled: April 21, 2008Publication date: June 18, 2009Applicant: AU OPTRONICS CORPORATIONInventors: Yu-Huan Liu, Chieh-Hsiu Lin, Chih-Lin Wang, Yun-Yi Tien
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Publication number: 20070034834Abstract: A compound represented by the following formula: SrxMyAlzSi12?zN16?zO2+z wherein, M is selected from the group consisting of rare earth elements and yttrium, x>0, y>0, x+y=2, and 0?z?5. The compound may be used as a phosphor. It emits a visible light upon being excited by a blue light and/or an ultra-violet light. When M is Eu, the compound emits a yellow-green light upon being excited by a blue light and/or an ultra-violet light.Type: ApplicationFiled: November 7, 2005Publication date: February 15, 2007Inventors: Yu-Huan Liu, Ru-Shi Liu, Yi-Shan Lin, Chuen-Ming Gee, Ching-Jang Lin, Biing-Jyh Weng, Tzong-Liang Tsai, Tzer-Perng Chen