Patents by Inventor Yui K. Tang

Yui K. Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Four-motion wire bonder
    Patent number: 4550871
    Abstract: A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.
    Type: Grant
    Filed: August 24, 1982
    Date of Patent: November 5, 1985
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Lo K. Chan, Yui K. Tang, Jui Chang