Patents by Inventor Yui KAGI

Yui KAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
    Publication number: 20210407867
    Abstract: A semiconductor wafer includes a surface having at least one recess including an inner wall surface. The inner wall surface is exposed.
    Type: Application
    Filed: September 7, 2021
    Publication date: December 30, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, Kioxia Corporation
    Inventors: Fuyuma ITO, Yasuhito YOSHIMIZU, Nobuhito KUGE, Yui KAGI, Susumu OBATA, Keiichiro MATSUO, Mitsuo SANO
  • SEMICONDUCTOR MEMORY DEVICE
    Publication number: 20200066748
    Abstract: According to one embodiment, a semiconductor memory device includes a stacked body in which a plurality of insulating layers and a plurality of conductive layers are alternately stacked above a substrate, a pillar that penetrates the stacked body while extending in a stacking direction of the stacked body, and a semiconductor layer, a first insulating layer, a charge accumulation layer, and a second insulating layer, which are stacked on a side surface of the pillar in order from the pillar, wherein the semiconductor layer has an average grain size that is larger on a side nearer to the pillar and is smaller on a side nearer to the first insulating layer.
    Type: Application
    Filed: December 4, 2018
    Publication date: February 27, 2020
    Applicant: Toshiba Memory Corporation
    Inventors: Daisuke MATSUSHITA, Yui KAGI, Tatsuya FUJISHIMA, Masayuki SHISHIDO, Nozomi KIDO, Tomonori KAJINO, Nobuhito KUGE