Abstract: A tweezer for adsorbing a semiconductor device allows easy and safe handling of the wafer by preventing rotation of the tweezer due to the weight of a wafer adsorbed off-center, and the breakage of the wafer caused thereby. The tweezer has a gun-shaped body, including a handle having a first vacuum line, and a barrel connected to the handle, the first vacuum line extending through the barrel. The first vacuum line is opened and closed by a trigger and shutter. A head is non-rotatably attached to the barrel, the head having a second vacuum line connected to the first vacuum line for adsorbing the wafer by the vacuum supplied inside the second vacuum line.