Abstract: The present invention provides a method for forming a device on a wafer without peeling, in which the wafer has a substrate forming thereon a first dielectric layer forming thereon a first conducting layer having thereon a device area and an edge area. This method includes steps of a) forming a second dielectric layer on the device area and the edge area, b) forming a photoresist layer on the second dielectric layer, c) selectively removing the second dielectric layer, the photoresist layer, and the first conducting layer from and presenting thereby the device area and the edge area with a desired dielectric layer, and d) forming a metal film on the device area and the edge area.

Abstract: The present invention discloses a method for reducing the reflectivity of a silicide layer. This invention utilizes a rapid thermal oxidation process to treat a tungsten silicide film in order to reduce the reflectivity of the tungsten silicide film. Thus, an anti-reflectivity layer is not required in the present invention. In addition simplify the present invention, a thin oxide layer is growth on the tungsten suicide layer during the rapid thermal oxidation process and the thin oxide layer serves as a hard mask in subsequent steps. In addition, because utilizing the rapid thermal process, the present invention can greatly reduce the resistance of the tungsten silicide in order to increase the speed of the devices.