Patents by Inventor Yui Takahashi
Yui Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12239010Abstract: A novel organometallic complex with high reliability is provided. A light-emitting element includes an EL layer between a pair of electrodes. The EL layer includes at least a light-emitting layer. The light-emitting layer contains an organometallic complex. The organometallic complex includes a first ligand and a second ligand which are coordinated to a central metal. The HOMO is distributed over the first ligand, and the LUMO is distributed over the second ligand. The first ligand and the second ligand are cyclometalated ligands.Type: GrantFiled: November 23, 2020Date of Patent: February 25, 2025Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Satoshi Seo, Hideko Inoue, Miki Kurihara, Yui Yamada, Tatsuyoshi Takahashi, Hiromitsu Kido
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Patent number: 12071174Abstract: A subframe (100) includes a base member (110) and a first member (121). The base member (110) is a channel-shaped member that includes a base surface portion (111) and two wall portions (112) on both sides of the base surface portion (111) in a vehicle length direction and is open on its lower side in a vehicle height direction. The first member (121) includes a bottom wall portion (121g), a top wall portion (121t), and a side wall portion (121s). The bottom wall portion (121g) and the top wall portion (121t) are disposed in the same direction as the base surface portion (111). The top wall portion (121t) is overlapped on and joined to the base surface portion (111). The wall portions (112) and the bottom wall portion (121g) form the channel shape. The side wall portion (121s) is a wall that blocks a vehicle width direction between the bottom wall portion (121g) and the top wall portion (121t).Type: GrantFiled: August 31, 2021Date of Patent: August 27, 2024Assignee: NIPPON STEEL CORPORATIONInventors: Junichiro Suzuki, Yohei Kato, Susumu Yuasa, Yui Takahashi, Daisuke Yasufuku, Hiroshi Yoshida
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Publication number: 20230311993Abstract: A subframe (100) includes a base member (110) and a first member (121). The base member (110) is a channel-shaped member that includes a base surface portion. (111) and two wall portions (112) on both sides of the base surface portion (111) in a vehicle length direction and is open on its lower side in a vehicle height direction. The first member (121) includes a bottom wall portion (121g), a top wall portion (121t), and a side wall portion (121s). The bottom wall portion (121g) and the top wall portion (121t) are disposed in the same direction as the base surface portion (111). The top wall portion (121t) is overlapped on and joined to the base surface portion (111). The wall portions (112) and the bottom wall portion (121g) form the channel shape. The side wall portion (121s) is a wall that blocks a vehicle width direction between the bottom wall portion (121g) and the top wall portion (121t).Type: ApplicationFiled: August 31, 2021Publication date: October 5, 2023Applicant: NIPPON STEEL CORPORATIONInventors: Junichiro SUZUKI, Yohei KATO, Susumu YUASA, Yui TAKAHASHI, Daisuke YASUFUKU, Hiroshi YOSHIDA
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Patent number: 11462449Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.Type: GrantFiled: December 26, 2018Date of Patent: October 4, 2022Assignee: NISSAN MOTOR CO., LTD.Inventors: Hiroshi Sato, Yoshinori Murakami, Hidekazu Tanisawa, Shinji Sato, Fumiki Kato, Kazuhiro Mitamura, Yui Takahashi
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Publication number: 20220044980Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.Type: ApplicationFiled: December 26, 2018Publication date: February 10, 2022Applicant: NISSAN MOTOR CO., LTD.Inventors: Hiroshi SATO, Yoshinori MURAKAMI, Hidekazu TANISAWA, Shinji SATO, Fumiki KATO, Kazuhiro MITAMURA, Yui TAKAHASHI
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Patent number: 10262914Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.Type: GrantFiled: November 28, 2016Date of Patent: April 16, 2019Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Katsushi Yamashita, Yui Takahashi
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Publication number: 20180337105Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.Type: ApplicationFiled: November 28, 2016Publication date: November 22, 2018Applicant: SUMITOMO BAKELITE CO., LTD.Inventors: Katsushi YAMASHITA, Yui TAKAHASHI
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Patent number: 6555268Abstract: A binder made of a mixture of a first binder component including styrene butadiene copolymer containing styrene at between 20% and 70%, and a second binder component selected from at least one of styrene butadiene copolymer containing styrene at between 80% and 100% and polystyrene is used for the negative electrode of rechargeable batteries comprising a carbon material and the binder. The use of the negative electrode comprising the carbon material and binder results in good resistance to peeling of a coated film, and thus ease of handling of a negative electrode sheet. Consequently, rechargeable batteries with good low-temperature discharge characteristics are supplied at good yield.Type: GrantFiled: May 10, 2000Date of Patent: April 29, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kaoru Inoue, Shusaku Goto, Yui Takahashi, Toyoji Sugimoto
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Patent number: 6436573Abstract: Graphite material capable of absorbing and desorbing lithium is employed as the negative electrode material of a non-aqueous electrolyte secondary battery, the negative electrode material being bound by at least one type of material selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-propylene-vinyl acetate copolymer, and polypropylene. A non-aqueous electrolyte secondary battery with a high anti-peeling strength of the electrode mix, superiority in the ease of handling, a high reliability in mass production, a superior low-temperature discharge characteristic and cycle characteristic is provided by employing the negative electrode in combination with a rechargeable positive electrode and a non-aqueous liquid electrolyte.Type: GrantFiled: August 16, 1999Date of Patent: August 20, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shusaku Goto, Kaoru Inoue, Yui Takahashi, Toyoji Sugimoto