Abstract: A light-emitting device having high heat resistance in a manufacturing process is provided.

Abstract: A subframe (100) includes a base member (110) and a first member (121). The base member (110) is a channel-shaped member that includes a base surface portion (111) and two wall portions (112) on both sides of the base surface portion (111) in a vehicle length direction and is open on its lower side in a vehicle height direction. The first member (121) includes a bottom wall portion (121g), a top wall portion (121t), and a side wall portion (121s). The bottom wall portion (121g) and the top wall portion (121t) are disposed in the same direction as the base surface portion (111). The top wall portion (121t) is overlapped on and joined to the base surface portion (111). The wall portions (112) and the bottom wall portion (121g) form the channel shape. The side wall portion (121s) is a wall that blocks a vehicle width direction between the bottom wall portion (121g) and the top wall portion (121t).

Abstract: A novel mixed material for a light-emitting device with improved heat resistance is provided. The mixed material for a light-emitting device includes a first heteroaromatic compound and a second heteroaromatic compound. The first heteroaromatic compound includes a first heteroaromatic ring. The first heteroaromatic ring includes a ring including two or more nitrogen atoms and any one of a benzene ring and a pyridine ring or a ring including a diazine ring or a triazine ring. The second heteroaromatic compound includes a second heteroaromatic ring. The second heteroaromatic ring includes a ring including two or more nitrogen atoms and any one of a benzene ring and a pyridine ring or a ring including a diazine ring or a triazine ring. A structure of the first heteroaromatic ring is different from a structure of the second heteroaromatic ring.

Abstract: A subframe (100) includes a base member (110) and a first member (121). The base member (110) is a channel-shaped member that includes a base surface portion. (111) and two wall portions (112) on both sides of the base surface portion (111) in a vehicle length direction and is open on its lower side in a vehicle height direction. The first member (121) includes a bottom wall portion (121g), a top wall portion (121t), and a side wall portion (121s). The bottom wall portion (121g) and the top wall portion (121t) are disposed in the same direction as the base surface portion (111). The top wall portion (121t) is overlapped on and joined to the base surface portion (111). The wall portions (112) and the bottom wall portion (121g) form the channel shape. The side wall portion (121s) is a wall that blocks a vehicle width direction between the bottom wall portion (121g) and the top wall portion (121t).

Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.

Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.

Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.

Abstract: Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, Ga2O3, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.

Abstract: A binder made of a mixture of a first binder component including styrene butadiene copolymer containing styrene at between 20% and 70%, and a second binder component selected from at least one of styrene butadiene copolymer containing styrene at between 80% and 100% and polystyrene is used for the negative electrode of rechargeable batteries comprising a carbon material and the binder. The use of the negative electrode comprising the carbon material and binder results in good resistance to peeling of a coated film, and thus ease of handling of a negative electrode sheet. Consequently, rechargeable batteries with good low-temperature discharge characteristics are supplied at good yield.

Abstract: Graphite material capable of absorbing and desorbing lithium is employed as the negative electrode material of a non-aqueous electrolyte secondary battery, the negative electrode material being bound by at least one type of material selected from the group consisting of polyethylene, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-propylene-vinyl acetate copolymer, and polypropylene. A non-aqueous electrolyte secondary battery with a high anti-peeling strength of the electrode mix, superiority in the ease of handling, a high reliability in mass production, a superior low-temperature discharge characteristic and cycle characteristic is provided by employing the negative electrode in combination with a rechargeable positive electrode and a non-aqueous liquid electrolyte.