Patents by Inventor Yuichi Dohki

Yuichi Dohki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
    Patent number: 6700186
    Abstract: A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: March 2, 2004
    Assignee: Mitsui High-tec, Inc.
    Inventors: Shoshi Yasunaga, Hideshi Hanada, Takahiro Ishibashi, Jun Sugimoto, Yuichi Dohki, Hitoshi Etoh
  • Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
    Publication number: 20020079561
    Abstract: A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 27, 2002
    Inventors: Shoshi Yasunaga, Hideshi Hanada, Takahiro Ishibashi, Jun Sugimoto, Yuichi Dohki, Hitoshi Etoh