Patents by Inventor Yuichi Hata

Yuichi Hata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230150750
    Abstract: Refrigerator door (25) includes outer packaging material (55) including a resin sheet, and a core material and gas adsorption each contained in outer packaging material (55). The gas adsorption device includes a vacuum sealed container containing a gas adsorbing substance that adsorbs various gases, an opening pin that opens the vacuum sealed container by a physical load from an outside, and a load-bearing spacer that suppresses displacement of the opening pin to less than or equal to a predetermined amount.
    Type: Application
    Filed: May 26, 2021
    Publication date: May 18, 2023
    Inventors: Toshiaki HIRANO, Hideji KAWARAZAKI, Tomoaki KITANO, Noriyuki MIYAJI, Yuichi HATA
  • Patent number: 10792671
    Abstract: A disassembling apparatus that shatters an object by means of pulsed discharge includes a container that can be filled with a liquid, an anode that is disposed within the container, a cathode that is disposed such that the object can be placed so as to straddle the anode and the cathode, object scattering prevention means that encloses an object disassembling region above the anode and the cathode, and a pulsed power supply that applies a high voltage pulse between the anode and the cathode.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 6, 2020
    Assignee: Panasonic Corporation
    Inventors: Noriyuki Suzuki, Genichiro Matsuda, Syougo Utumi, Yuichi Hata, Takao Namihira
  • Publication number: 20170348700
    Abstract: A disassembling apparatus that shatters an object by means of pulsed discharge includes a container that can be filled with a liquid, an anode that is disposed within the container, a cathode that is disposed such that the object can be placed so as to straddle the anode and the cathode, object scattering prevention means that encloses an object disassembling region above the anode and the cathode, and a pulsed power supply that applies a high voltage pulse between the anode and the cathode.
    Type: Application
    Filed: May 22, 2017
    Publication date: December 7, 2017
    Inventors: NORIYUKI SUZUKI, GENICHIRO MATSUDA, SYOUGO UTUMI, YUICHI HATA, TAKAO NAMIHIRA
  • Patent number: 8920536
    Abstract: An ore containing crystal water (bond water) is heated to dehydrate the crystal water in the form of water vapor, thereby rendering the ore porous to generate a porous ore. Next, the porous ore is forced into contact with a dry-distilled gas (organic gas) obtained by dry-distillation of an organic substance such as wood and the like or an organic liquid such as tar and the like. An organic compound such as tar and the like contained in the dry-distilled gas or organic liquid adheres to the surface of the porous ore. Next, the porous ore adhered with an organic compound is heated at 500° C. or higher, to generate an ore in which a part of an oxide of an element such as iron and the like contained is reduced by carbon in the organic compound.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: December 30, 2014
    Assignees: Bio Coke Lab. Ltd.
    Inventors: Tomohiro Akiyama, Yuichi Hata, Sou Hosokai, Xinghe Zhang, Purwanto Hadi, Junichiro Hayashi, Yoshiaki Kashiwaya, Hiroshi Uesugi
  • Patent number: 8724289
    Abstract: A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: May 13, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Norio Shiraiwa, Yuichi Hata
  • Publication number: 20120287552
    Abstract: A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses.
    Type: Application
    Filed: April 23, 2012
    Publication date: November 15, 2012
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Norio SHIRAIWA, Yuichi Hata
  • Patent number: 8023246
    Abstract: In a method of manufacturing an electrostatic chuck, the method includes: a step of providing an electrostatic chucking portion including an electrode to which a voltage is applied and a film-like insulating layer covering the electrode; a step of bonding an elastomer layer onto the electrostatic chucking portion; a step of bonding a metal base onto the elastomer layer such that recess portions formed on a surface of the metal base face the elastomer layer.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: September 20, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Norio Shiraiwa, Takeshi Kobayashi, Yuichi Hata, Naoto Watanabe
  • Publication number: 20100031777
    Abstract: An ore containing crystal water (bond water) is heated to dehydrate the crystal water in the form of water vapor, thereby rendering the ore porous to generate a porous ore. Next, the porous ore is forced into contact with a dry-distilled gas (organic gas) obtained by dry-distillation of an organic substance such as wood and the like or an organic liquid such as tar and the like. An organic compound such as tar and the like contained in the dry-distilled gas or organic liquid adheres to the surface of the porous ore. Next, the porous ore adhered with an organic compound is heated at 500° C. or higher, to generate an ore in which a part of an oxide of an element such as iron and the like contained is reduced by carbon in the organic compound.
    Type: Application
    Filed: September 6, 2007
    Publication date: February 11, 2010
    Inventors: Tomohiro Akiyama, Yuichi Hata, Sou Hosokai, Xinghe Zhang, Purwanto Hadi, Junichiro Hayashi, Yoshiaki Kashiwaya, Hiroshi Uesugi
  • Patent number: 7483256
    Abstract: An electrostatic chuck includes a base plate, an electrode layer having flexibility, covering the surface of the base plate, and a power supply unit for electrically connecting the electrode layer to the power source side. The power supply unit includes a connection piece including a wire, and electrically conductive components to be used in connection to the power source side. The wire is connected to an electrode of the electrode layer, and extends from the side edge of the electrode layer. The electrically conductive component is electrically connected with the wire, and fixes the connection piece bent along the side surface of the base plate to the base plate.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: January 27, 2009
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Norio Shiraiwa, Yuichi Hata, Naoto Watanabe
  • Publication number: 20080278883
    Abstract: In a method of manufacturing an electrostatic chuck, the method includes: a step of providing an electrostatic chucking portion including an electrode to which a voltage is applied and a film-like insulating layer covering the electrode; a step of bonding an elastomer layer onto the electrostatic chucking portion; a step of bonding a metal base onto the elastomer layer such that recess portions formed on a surface of the metal base face the elastomer layer.
    Type: Application
    Filed: May 7, 2008
    Publication date: November 13, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Norio Shiraiwa, Takeshi Kobayashi, Yuichi Hata, Naoto Watanabe
  • Publication number: 20080266747
    Abstract: In an electrostatic chuck for chucking a glass substrate, the electrostatic chuck includes a pair of electrodes embedded in a ceramic material and interlaced with each other, where a volume resistivity of the ceramic material is 1×108 ?cm to 1×1014 ?cm, a thickness of the ceramic material on a chucking surface side to cover the pair of electrodes is 100 ?m to 200 ?m, a pattern width of the pair of electrodes is 0.5 mm to 1 mm, and a minimum distance between the pair of electrodes is 0.5 mm to 1 mm.
    Type: Application
    Filed: April 25, 2008
    Publication date: October 30, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Norio Shiraiwa, Takeshi Kobayashi, Yuichi Hata, Naoto Watanabe
  • Publication number: 20080080118
    Abstract: An electrostatic chuck includes a base plate, an electrode layer having flexibility, covering the surface of the base plate, and a power supply unit for electrically connecting the electrode layer to the power source side. The power supply unit includes a connection piece including a wire, and electrically conductive components to be used in connection to the power source side. The wire is connected to an electrode of the electrode layer, and extends from the side edge of the electrode layer. The electrically conductive component is electrically connected with the wire, and fixes the connection piece bent along the side surface of the base plate to the base plate.
    Type: Application
    Filed: September 19, 2007
    Publication date: April 3, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Norio Shiraiwa, Yuichi Hata, Naoto Watanabe
  • Patent number: 5656557
    Abstract: Disclosed is a production process and apparatus of high-purity air and various air material gases for semiconductor production factories that, together with enabling the production of high-purity air, also enables the production high-purity nitrogen simultaneous to the production of oxygen-rich air as the finished product. This is accomplished by compressing feed air to a pressure of 3 to 10 kg/cm.sup.2 G, introducing this compressed air into a catalyst tower (8) to convert the carbon monoxide, hydrocarbons and hydrogen contained in the feed air into carbon dioxide and water, and introducing the purified air into an adsorption tower (12a) or (12b) after cooling the heated air following catalytic reaction to remove carbon dioxide, water and other minute amounts of impurities by adsorption. A portion of the resulting purified air is removed as product high-purity air, while the remainder is introduced into a main heat exchanger (18) where it is cooled to substantially the liquefaction temperature.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: August 12, 1997
    Assignee: Nippon Sanso Corporation
    Inventors: Yuichi Hata, Jun Sasaki, Mamoru Kawamura, Maki Nakamura, Kazuya Taki, Shuichi Okada