Abstract: In accordance with the present invention, there are provided high molecular weight polyethylene molecular orientation molded articles formed from high molecular weight polyethylenes having a weight average molecular weight of 300,000-600,000, said molecular orientation molded articles having a fineness of not more than 15 deniers, a tensile strength of more than at least 1.7 GPa and satisfying the tensile strength S (GPa)-weight average molecular weight M. (g/mol)-fineness D (denier) relationship represented by the formula [I] ##EQU1## and processes for preparing the same. Further in accordance with the present invention, there are also provided high molecular weight polyethylene molecular orientation molded articles formed from high molecular weight polyethylene having a weight average molecular weight of exceeding 600,000 and satisfying the relationship represented by the formula [II].

Abstract: In a vehicle control unit structure, a pair of first and second circuit boards in each of which conductive layers are adhered on a metal substrate through an insulating layer, and a circuit element is fixed to each of the conductive layers are arranged so that the conductive layers are connected to each other through a connecting substrate and are arranged to oppose each other. A third circuit board is located between the first and second circuit boards. The foregoing vehicle control unit structure is arranged into a closed case-like shape, thus preventing dust contamination and direct access by an operator and achieving a low cost, compact unit. A circuit element is mounted on the third circuit board.

Abstract: In a connector structure for a hybrid integrated circuit, two hybrid integrated circuit boards each include a conductive layer having a predetermined pattern formed thereon and a plurality of circuit elements attached onto the conductive layer. The two integrated boards are separated from each other so that the conductive layers of the circuit boards oppose each other. The connector structure is provided with a pair of connecting pin support members which are fixed to the two hybrid integrated circuit boards, and on which a plurality of connecting pins connected to the conductive layers are attached. A connector housing has a fitting hole in which the connecting pin support members are fitted while overlapping each other.

Abstract: A sealing structure for a ball joint of a wiper link mechanism is provided with a boot. A boot-engaging part is formed on an outer periphery adjacent an opening of said ball retainer and a retainer-engaging part is formed at the end of the boot which includes a flexible part. The boot can seal the opening of the ball retainer in the limited space between the plate-shaped link arm and the plate-shaped link connecting rod in the state in which the ball pin is coupled to the ball retainer. It is able to prevent water, mud or the like from entering into the spherical hollow of the ball retainer even if the link arm and the link connected rod are inclined to each other.