Abstract: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.

Abstract: An IC tag has a layer of heat sensitive color developing material (I), a layer of material absorbing light and converting absorbed light into heat (II) and a protective layer (III) laminated on the surface of the support successively from the surface, or (II), (I) and (III) laminated on the surface of the support successively from the surface. This structure permits recording and erasing invisible information and recording and erasing visible information, both allowing recording and erasing information in a non-contact manner. The structure is flexible and can have a small size.

Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.

Abstract: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

Abstract: An IC tag which has a means for recording and erasing invisible information and a means for recording and erasing visible information, both allowing recording and erasing information in a non-contact manner, exhibits flexibility and can have a small size is provided. The IC tag has a means for recording and erasing invisible information and a means for recording and erasing visible information which are disposed on the surface of a support and allow recording and erasure of the information in a non-contact manner, wherein the means for recording and erasing visible information has a layer of a heat sensitive color developing material (I), a layer of a material absorbing light and converting absorbed light into heat (II) and a protective layer (III) laminated on the surface of the support successively from the surface, or (II), (I) and (III) laminated on the surface of the support successively from the surface.

Abstract: A magnetic detection-tag deactivating apparatus for deactivating a magnetic detection-tag, having preferable operability when deactivating operation, and further enabling to increase accuracy of deactivation, includes: at least one or a plurality of deactivating rollers, disposing one or more cylindrical unitary permanent magnets, on a periphery surface of which is magnetized to N-pole and/or S-pole, along an axial direction thereof, whereby deactivating the magnetic detection-tag through a relative movement between the magnetic detection-tag and the deactivating roller. Herein, it is preferable that the deactivating roller is provided in rotatable manner.

Abstract: The present invention discloses a decision machine of detection tag using magnetic field, comprising: a cross coil 22 constituted by a plurality of individual coils which have been wound round a frame member so as to form a predetermined differential angle between the central axes of the individual coils, a magnetic power supply part 24 comprising an oscillator for generating an AC power and a phase modulator for differing each other the phase of AC power generated by the oscillator, by a predetermined differential angle, to supply powers of different phases to the individual coils, a signal processor part 28 connected to the plurality of individual coils, and a decision part 30 for deciding the output signal sent from the signal processor part.

Abstract: The present invention discloses a method for reactivating a magnetic detection tag, which comprises exposing a magnetic detection tag having a soft magnetic substance layer and a hard magnetic substance layer, to an alternating magnetic field generated by applying an AC power to a coil, moving, in this state, either or both of the magnetic detection tag and the alternating magnetic field, thereby sweeping the magnetic detection tag in the alternating magnetic field to demagnetize the magnetized hard magnetic substance layer of the magnetic detection tag; and a machine for reactivating a magnetic detection tag.

Abstract: A compact magnetic object detection device with high degree of freedom for installation can be provided. The magnetic object detection device includes magnetic field generating mechanism for radiating an alternating magnetic field in a vicinity space; one or a plurality of loop antennas which convert the magnetic field in the vicinity space into an electric signal; determining mechanism for analyzing an existence of magnetostriction and determining an existence of a magnetic object, the magnetostriction generated by the magnetic object existing in the vicinity space based on the electric signal of each of the loop antennas. An installation member, attached with at least the magnetic field generating mechanism and each of the loop antennas, has a pole shape.

Abstract: To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.

Abstract: A loop antenna is constructed by bending a linear conductor so that it forms concavo-convex portions within an antenna plane.

Abstract: Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.

Abstract: A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.

Abstract: A loop antenna is constructed by bending a linear conductor so that it forms concavo-convex portions within an antenna plane.

Abstract: A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.

Abstract: To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.

Abstract: Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.