Patents by Inventor Yuichi Kazue

Yuichi Kazue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10672659
    Abstract: An electronic component manufacturing method includes preparing a structure including a conductive member, forming a seed metal layer including first and second portions electrically connected to the conductive member on a surface of the structure, forming a plating layer on the first portion of the seed metal layer in a state in which the second portion of the seed metal layer is covered by a first member, forming a conductive second member on the first portion of the seed metal layer via the plating layer, and etching the second portion of the seed metal layer in a state in which the plating layer is covered by the second member.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: June 2, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yuichi Kazue
  • Patent number: 10497731
    Abstract: A photoelectric conversion device includes a semiconductor substrate having a photoelectric conversion unit, a magnetic layer arranged over an opposite side to a light-receiving face of the semiconductor substrate, and an infrared ray absorbing layer arranged between the semiconductor substrate and the magnetic layer.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: December 3, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yuichi Kazue, Takahiro Hachisu
  • Patent number: 10424548
    Abstract: According to one aspect of the present invention, a method of manufacturing a semiconductor device is provided, which includes a bonding step bonding a semiconductor substrate having a semiconductor element disposed on a first surface, to a support substrate, at least through an adhesive layer between the semiconductor substrate and the support substrate, and a groove forming step forming a groove in a scribe area of the semiconductor substrate, from a side of a second surface of the semiconductor substrate, the second surface being opposite to the first surface, and in the groove forming step, a conductive layer between the semiconductor substrate and the support substrate is exposed at a bottom of the groove, without the adhesive layer being exposed in the groove.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: September 24, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yuichi Kazue, Takahiro Hachisu, Hidemasa Oshige
  • Publication number: 20180247868
    Abstract: An electronic component manufacturing method includes preparing a structure including a conductive member, forming a seed metal layer including first and second portions electrically connected to the conductive member on a surface of the structure, forming a plating layer on the first portion of the seed metal layer in a state in which the second portion of the seed metal layer is covered by a first member, forming a conductive second member on the first portion of the seed metal layer via the plating layer, and etching the second portion of the seed metal layer in a state in which the plating layer is covered by the second member.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 30, 2018
    Inventor: Yuichi Kazue
  • Publication number: 20180233524
    Abstract: A photoelectric conversion device includes a semiconductor substrate having a photoelectric conversion unit, a magnetic layer arranged over an opposite side to a light-receiving face of the semiconductor substrate, and an infrared ray absorbing layer arranged between the semiconductor substrate and the magnetic layer.
    Type: Application
    Filed: February 5, 2018
    Publication date: August 16, 2018
    Inventors: Yuichi Kazue, Takahiro Hachisu
  • Publication number: 20180090453
    Abstract: According to one aspect of the present invention, a method of manufacturing a semiconductor device is provided, which includes a bonding step bonding a semiconductor substrate having a semiconductor element disposed on a first surface, to a support substrate, at least through an adhesive layer between the semiconductor substrate and the support substrate, and a groove forming step forming a groove in a scribe area of the semiconductor substrate, from a side of a second surface of the semiconductor substrate, the second surface being opposite to the first surface, and in the groove forming step, a conductive layer between the semiconductor substrate and the support substrate is exposed at a bottom of the groove, without the adhesive layer being exposed in the groove.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 29, 2018
    Inventors: Yuichi Kazue, Takahiro Hachisu, Hidemasa Oshige