Abstract: An injection molding system including an injection molding apparatus that performs injection molding with a mold, and a conveyor apparatus that moves the mold to a position in the injection molding apparatus, wherein the improvement to the injection molding system includes a connection part configured to fix the conveyor apparatus with the injection molding apparatus such that a side surface of the injection molding apparatus and a side surface of the conveyor apparatus facing each other are spaced apart.

Abstract: An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided thereon with hooks, which are engaged with hook engagements provided on a base of the heat sink. A top plate of the fan unit mounting frame is provided thereon with projections acting as a first pivotal movement preventing engagement structure and fitted in gaps defined between adjacent radiation fins of a radiation fin unit. Also, the top plate is provided thereon with projections which are abutted against end surfaces of the radiation fins positioned in a second direction, to thereby act as a second pivotal movement preventing engagement structure for preventing pivotal movement of the top plate in the second direction.

Abstract: A heat sink preform having a base 2, a fan case engagement portion 3 and a radiating fin formation portion is integrally formed by extrusion molding. A plurality of radiating fins 5 having a tong ratio which is defined as a ration of the height of the radiating fins with respect to the interval dimension between neighboring radiating fins of more than or equal to 10 is formed by subjecting the radiating fin formation portion to cutting work. In this way, a cooling fan attached type heat sink with a plurality of radiating fins having a shape that is difficult to be formed or cannot be formed or having a large tong ratio can be produced with low costs and with relative ease.

Abstract: An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided thereon with hooks, which are engaged with hook engagements provided on a base of the heat sink. A top plate of the fan unit mounting frame is provided thereon with projections acting as a first pivotal movement preventing engagement structure and fitted in gaps defined between adjacent radiation fins of a radiation fin unit. Also, the top plate is provided thereon with projections which are abutted against end surfaces of the radiation fins positioned in a second direction, to thereby act as a second pivotal movement preventing engagement structure for preventing pivotal movement of the top plate in the second direction.

Abstract: An electronic component cooling apparatus capable of enhancing cooling efficiency while having a heat sink including a plurality of radiation fins which are arranged in parallel to each other incorporated therein. Radiation fins of a heat sink are arranged in parallel to a pair of side walls of the heat sink and so as to be spaced from each other at intervals. The heat sink is formed with a plurality of parting slits for interrupting continuity of a part of a base of the heat sink and radiation fins adjacent to the side walls of the heat sink. The parting slits are arranged so as to extend from an outside of the side walls of the heat sink into the heat sink and in a manner to be spaced from each other at predetermined intervals. The parting slits are formed into a length which prevents the parting slits from interrupting continuity of a portion of the radiation fins which is not exposed directly to air flow generated from by rotation of blades of an impeller of an axial fan unit.

Abstract: An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled. An impeller which includes a plurality of blades for sucking air from one side in an axial direction of a revolving shaft of a motor is fixed on a rotor of the motor. A casing having a cylindrical cavity defined therein in which the motor and impeller are received is constructed of a peripheral wall arranged so as to surround the impeller and a closing wall for closing an end of the cavity on the other side in the axial direction. The peripheral wall is formed at a portion thereof in proximity to an end thereof on the one side with a lateral discharge port through which air suckedly introduced into the cavity is discharged so that a surrounding portion for surrounding a whole circumference of the impeller is left at a portion of the peripheral wall in proximity to an end on the other side.

Abstract: An electronic component cooling apparatus capable of minimizing a reduction in cooling efficiency even when discharge of air heated is restricted to two directions and reducing a manufacturing cost. The cooling apparatus includes a heat sink including an elongated base having a plurality of radiation fins arranged thereon, as well as a fan unit. The fan unit includes a casing in which an impeller provided with a plurality of blades and a motor for revolving the impeller are received. The casing is releasably mounted on the heat sink. The heat sink and the casing of the fan unit cooperate with each other to define two discharge ports and form an air flow space which continuously extends between an end of the radiation fins facing the casing and an opposite wall of the casing.

Abstract: An electronic component cooling apparatus capable of minimizing or substantially preventing a reduction in cooling efficiency even when discharge of air heated is restricted to two directions. The cooling apparatus includes a heat sink including an elongated base having a plurality of radiation fins arranged thereon, as well as a fan unit. The fan unit includes an impeller provided with a plurality of blades, a motor for revolving the impeller and a casing formed with a suction opening for receiving the impeller and motor therein. The casing is releasably mounted on the heat sink. The heat sink and casing of the fan unit cooperate with each other to define two discharge ports on both ends of the base in a longitudinal direction thereof. The casing is provided with a pair of guide extensions for air guide in a manner to extend in a longitudinal direction of the base of the heat sink.

Abstract: A heating element cooling apparatus which is capable of improving the cooling efficiency without greatly increasing the overall weight thereof. A heat sink 2 for the heating element cooling apparatus is equipped with an air fan 1. A heat conducting element 3 having higher heat conductivity than a base 2a of the heat sink 2 is conductivity attached to the base 2a. Plural radiation fins 6 are mounted on an extended portion 3c of the heat conducting element 3 which extends exceeding the base 2a. The heat generated by a heating element 4, which is heat-conductively attached on the heat conducting element 3, is outwardly conducted toward the peripheral portion of the heat sink through the heat conducting element 3 and radiated from the radiation fins 2b, resulting in increasing the radiation efficiency.

Abstract: An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled. An impeller which includes a plurality of blades for sucking air from one side in an axial direction of a revolving shaft of a motor is fixed on a rotor of the motor. A casing having a cylindrical cavity defined therein in which the motor and impeller are received is constructed of a peripheral wall arranged so as to surround the impeller and a closing wall for closing an end of the cavity on the other side in the axial direction. The peripheral wall is formed at a portion thereof in proximity to an end thereof on the one side with a lateral discharge port through which air suckedly introduced into the cavity is discharged so that a surrounding portion for surrounding a whole circumference of the impeller is left at a portion of the peripheral wall in proximity to an end on the other side.

Abstract: An electronic component cooling apparatus capable of permitting a sufficient amount of air to be fed to an electronic component to be cooled. An impeller which includes a plurality of blades for sucking air from one side in an axial direction of a revolving shaft of a motor is fixed on a rotor of the motor. A casing having a cylindrical cavity defined therein in which the motor and impeller are received is constructed of a peripheral wall arranged so as to surround the impeller and a closing wall for closing an end of the cavity on the other side in the axial direction. The peripheral wall is formed at a portion thereof in proximity to an end thereof on the one side with a lateral discharge port through which air suckedly introduced into the cavity is discharged so that a surrounding portion for surrounding a whole circumference of the impeller is left at a portion of the peripheral wall in proximity to an end on the other side.

Abstract: A heat sink for an electronic component cooling apparatus being small in size and having reduced weight, being capable of coping with increasing amounts of heat generation from the electronic component and capable of performing high cooling efficiency.A plurality of radiation fins 3 surrounding an impeller of a fan are mounted on a side of a base 2 of a heat sink 1. A heat conductive thick portion comprising linear ribs 4 and an annular rib 5 is formed on the base 2 where it is surrounded by the radiation fins 3. The linear ribs 4 and the annular rib 5, having more thickness than the radiation fin mounting area 6, are formed of a pattern that can reduce the resistance of heat transfer between a heat source opposed-portion 7, which opposes to the heat source of the electronic component and the radiation fin mounting area 6.