Abstract: An electronic apparatus is provided and includes a light transmitting module configured to convert an electric signal into an optical signal and emit light, a light receiving module configured to receive the light emitted from the light transmitting module and convert the optical signal into an electric signal, and a mover unit configured to cause at least one of the light transmitting module and the light receiving module to carry out linear movement along an optical axis of the light emitted from the light transmitting module and/or rotation about the optical axis.

Abstract: An image processing apparatus includes a position movement input unit configured to receive a position movement instruction from a user, a pointer movement unit configured to set a position of a pointer that moves in accordance with the instruction, and a screen movement unit configured to scroll a screen based on a relative position of the pointer with respect to a reference point of a predefined area around the pointer, the screen movement unit configured to move the predefined area to keep the pointer inside the predefined area when the pointer is at a border of the predefined area and moves towards an outside of the predefined area.

Abstract: A conveying device including: a storage unit storing two or more sheets of slide glasses to be subjected to a predetermined treatment; a stage holding only one sheet of slide glass to be subjected to the treatment; a supply arm by which one sheet of slide glass to be subjected to the treatment is picked up from the storage unit and supplied onto the stage; a discharge arm by which the slide glass mounted on the stage is picked up and discharged in the storage unit; a moving unit operable to move the supply arm and the discharge arm in an integral manner so as to bring the supply arm or the discharge arm into proximity to each of the storage unit and the stage; and a control unit operable to control the supply arm, the discharge arm and the moving unit.

Abstract: A slide glass storage device including: a supply tray which has a supply holding space determined by a longer edge upper limit allowed for a longer edge of a slide glass and a shorter edge upper limit allowed for a shorter edge of the slide glass and on which a slide glass to be supplied to a treatment unit operable to perform a predetermined treatment is mounted; a discharge tray which has a discharge holding space determined by a longer edge longer than the longer edge upper limit and a shorter edge longer than the shorter edge upper limit and on which a slide glass having been subjected to the treatment in the treatment unit and being to be discharged is mounted; and a support unit supporting the supply tray and the discharge tray.

Abstract: Disclosed herein is a stage system, including: a stage on which to mount a slide glass; a projection block projected more than the thickness of the slide glass to the side of that surface of the stage on which to dispose the slide glass; and a pressing block which is provided on that surface of the stage on which to dispose the slide glass, is thicker than the slide glass, and presses toward the projection block the slide glass disposed between itself and the projection block.

Abstract: The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

Abstract: The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

Abstract: The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

Abstract: The size of a semiconductor device is reduced. A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin portion. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with the area positioned directly above a gate pad electrode of the lower semiconductor chip. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other.

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members.

Abstract: An electronic apparatus is provided and includes a light transmitting module configured to convert an electric signal into an optical signal and emit light, a light receiving module configured to receive the light emitted from the light transmitting module and convert the optical signal into an electric signal, and a mover unit configured to cause at least one of the light transmitting module and the light receiving module to carry out linear movement along an optical axis of the light emitted from the light transmitting module and/or rotation about the optical axis.

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members.

Abstract: An optical connector assembly has a plug connector having a first optical element for performing emission or receipt of light and a first lens. It also has a receptacle connector having a second optical element for performing receipt or emission of light and a second lens. The plug connector includes a convex portion having sectional configuration of round arch and the first lens, and a plug portion formed on a forward end of the convex portion. The plug portion is perpendicular to first optical axis of the first optical element and the first lens. The receptacle connector includes a concave portion into which the convex portion is inserted and a receptacle portion in a bottom of the concave portion. The receptacle portion is perpendicular to second optical axis of the second optical element and the second lens. The plug or receptacle connector has supporting mechanism that supports the connector movably.

Abstract: An optical connector assembly has a plug connector having a first optical element for performing emission or receipt of light and a first lens. It also has a receptacle connector having a second optical element for performing receipt or emission of light and a second lens. The plug connector includes a convex portion having sectional configuration of round arch and the first lens, and a plug portion formed on a forward end of the convex portion. The plug portion is perpendicular to first optical axis of the first optical element and the first lens. The receptacle connector includes a concave portion into which the convex portion is inserted and a receptacle portion in a bottom of the concave portion. The receptacle portion is perpendicular to second optical axis of the second optical element and the second lens. The plug or receptacle connector has supporting mechanism that supports the connector movably.

Abstract: A core for photographic light-sensitive material use made of wooden source material which can be recycled or decomposed in natural environment is disclosed. The core center is made of paper covered with a buffer layer made of 100% wooden pulp having a density of not more than 0.1 g/cm.sup.3. The buffer layer is covered with a reinforcing sheet made of paper with a tensile strength of 0.3 kg/15 mm width or more.