Patents by Inventor Yuichi Nakamura

Yuichi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9539252
    Abstract: Provided is a superior, novel heterocyclic compound with improved solubility in oil such as sesame oil and benzyl benzoate, which has a broader treatment spectrum, causes less side effects, and is superior in tolerability and safety, and use thereof. A heterocyclic compound represented by the formula (I) wherein each symbol is as defined in the specification, or a salt thereof.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: January 10, 2017
    Assignee: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Hiroshi Yamashita, Yohji Sakurai, Motoyuki Miyamoto, Yuichi Nakamura, Hideaki Kuroda, Takuya Minowa
  • Publication number: 20160368352
    Abstract: A vehicle door impact beam includes a main body portion and terminal portions. The main body portion includes a first bottom wall portion, a pair of first side wall portions, and a pair of first flange portions formed at ends of the first side wall portions, respectively. The first side wall portions include first wall portions respectively extending from widthwise ends of the first bottom wall portion toward one direction, and second wall portions respectively extending from ends of the first wall portions toward the one direction. The second wall portions approach each other as extending from ends on the first wall portions side toward end potions on the one direction side. The first flange portions are formed outside a space surrounded by the first bottom wall portion and the pair of first side wall portions.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 22, 2016
    Applicants: AISIN SEIKI KABUSHISIKI KAISHA, HISADA CO., LTD.
    Inventors: Tatsuya TSUKAMOTO, Koji YOSHIDA, Kohei HODOYA, Yuichi NAKAMURA, Masashi SAEKI, Masahiro HASHIGUCHI
  • Patent number: 9512652
    Abstract: In an opening/closing operation device for a vehicle open/close door, a handle and a lever for transmitting an unlock operation force to a latch mechanism are turnably supported by an open/close door, and one end portion of the lever is brought into contact with a contact surface formed in the handle. In the contact surface, at least a portion to be in contact with the one end portion of the lever at an initial stage of the manipulation of the handle is formed in an inclined manner or curvedly: in a way that makes the portion situated more forward in a movement direction, in which the contact surface moves in response to the turn of the handle, as the portion comes closer to a rotary fulcrum of the lever in a direction along a plane orthogonal to the movement direction such that the portion intersects the plane.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: December 6, 2016
    Assignees: Kabushiki Kaisha Honda Lock, Honda Motor Co., Ltd.
    Inventors: Tatsuro Ono, Hiroto Fujiwara, Yuichi Nakamura, Yuichiro Yamaoka, Masatoshi Adachi
  • Patent number: 9474158
    Abstract: A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: October 18, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takeshi Furusawa, Keisuke Shimizu, Yuichi Nakamura
  • Patent number: 9454033
    Abstract: A liquid crystal display device sandwiching liquid crystal between a TFT substrate having a rectangular plane and an opposing substrate having a rectangular plane, wherein a long side of the TFT substrate is longer than a long side of the opposing substrate, the long side of the opposing substrate is formed with a chamfer, and a light shielding film made of metal is formed on the TFT substrate around a position corresponding to the center of the long side of the opposing substrate. By using the light shielding film, the chipping condition of the opposing substrate near the chamfer can be accurately and rapidly evaluated.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: September 27, 2016
    Assignee: JAPAN DISPLAY INC.
    Inventors: Makoto Tatemura, Yuichi Nakamura, Masaharu Itakura, Yoshitomo Ogishima
  • Publication number: 20160202547
    Abstract: A liquid crystal display device sandwiching liquid crystal between a TFT substrate having a rectangular plane and an opposing substrate having a rectangular plane, wherein a long side of the TFT substrate is longer than a long side of the opposing substrate, the long side of the opposing substrate is formed with a chamfer, and a light shielding film made of metal is formed on the TFT substrate around a position corresponding to the center of the long side of the opposing substrate. By using the light shielding film, the chipping condition of the opposing substrate near the chamfer can be accurately and rapidly evaluated.
    Type: Application
    Filed: September 23, 2015
    Publication date: July 14, 2016
    Inventors: Makoto TATEMURA, Yuichi NAKAMURA, Masaharu ITAKURA, Yoshitomo OGISHIMA
  • Patent number: 9391044
    Abstract: A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 12, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Keisuke Shimizu, Yuichi Nakamura, Tsuyoshi Yamaguchi
  • Publication number: 20160143905
    Abstract: Provided is a superior, novel heterocyclic compound with improved solubility in oil such as sesame oil and benzyl benzoate, which has a broader treatment spectrum, causes less side effects, and is superior in tolerability and safety, and use thereof. A heterocyclic compound represented by the formula (I) wherein each symbol is as defined in the specification, or a salt thereof.
    Type: Application
    Filed: December 29, 2015
    Publication date: May 26, 2016
    Applicant: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Hiroshi Yamashita, Yohji Sakurai, Motoyuki Miyamoto, Yuichi Nakamura, Hideaki Kuroda, Takuya Minowa
  • Publication number: 20160142493
    Abstract: The sensor data collection system includes one or a plurality of sensors; a gateway device capable of collecting, converting, processing, making a threshold determination of, and compressing data from the sensors and transmitting the data to a data collection server at a timing set as needed; and the data collection server that collects the sensor data from the gateway device. The data collection server includes a means that compresses sensor data conversion, processing, threshold determination, compression, and transmission timing settings into a binary and transmits the binary to the gateway device. The gateway device includes a means that executes conversion, processing, threshold determination, and compression with respect to the data collected from the sensors in accordance with the various settings compressed into the binary, and that transmits the sensor data to the data collection server at the set transmission timing.
    Type: Application
    Filed: May 14, 2014
    Publication date: May 19, 2016
    Inventors: Akira MORIGUCHI, Noriko TAKADA, Kenji OOKURA, Yuichi NAKAMURA, Tomoki YADA
  • Patent number: 9292395
    Abstract: A debug stub server comprises: an arbitration unit that receives a plurality of control instructions given to a debug program from a plurality of information terminals, selects a simultaneously executable control instruction set from among the plurality of control instructions by arbitrating the plurality of control instructions, and forwards the selected control instruction set to the debug program; and a forwarding unit that forwards a debug result obtained by the debug program based on the control instruction set selected by the arbitration unit to the plurality of information terminals.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: March 22, 2016
    Assignee: NEC CORPORATION
    Inventor: Yuichi Nakamura
  • Publication number: 20160078105
    Abstract: A detailed information providing server includes: an acquisition unit configured to acquire search log information in which a search query is associated with link destination information of a search result obtained by a search using the search query; and a storage unit configured to determine whether or not a keyword corresponding to the search query is included in a news article available on the Internet, and store detailed information in association with the news article into an associated information DB when determining that the keyword is included, the detailed information being acquired by making access according to the link destination information associated with the search query.
    Type: Application
    Filed: September 4, 2015
    Publication date: March 17, 2016
    Inventors: Yuichi NAKAMURA, Shinichiro YASUI, Kazuo YAMASHITA, Masashi KUSANO
  • Patent number: 9288910
    Abstract: A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: March 15, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Keisuke Shimizu, Yuichi Nakamura, Tsuyoshi Yamaguchi
  • Patent number: 9260420
    Abstract: Provided is a superior, novel heterocyclic compound with improved solubility in oil such as sesame oil and benzyl benzoate, which has a broader treatment spectrum, causes less side effects, and is superior in tolerability and safety, and use thereof. A heterocyclic compound represented by the formula (I) wherein each symbol is as defined in the specification, or a salt thereof.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: February 16, 2016
    Assignee: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Hiroshi Yamashita, Yohji Sakurai, Motoyuki Miyamoto, Yuichi Nakamura, Hideaki Kuroda, Takuya Minowa
  • Publication number: 20160044789
    Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.
    Type: Application
    Filed: August 6, 2015
    Publication date: February 11, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Keisuke SHIMIZU, Makoto TERUI, Ryojiro TOMINAGA, Yuichi NAKAMURA
  • Patent number: 9218174
    Abstract: The invention automatically installs an OSGi bundle needed to use an external device connected to an electronic device having an OSGi framework mounted. The OSGi bundle is installed into the electronic device without imposing a load on a distribution system. The OSGi program related to the invention detects the external device connected to the electronic device having the OSGi framework mounted, downloads an OSGi bundle corresponding to said external device from a distribution server, and installs the OSGi bundle in the electronic device.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: December 22, 2015
    Assignee: Hitachi Solutions, Ltd.
    Inventors: Shinya Nobuoka, Yuichi Nakamura
  • Patent number: 9206173
    Abstract: The present invention provides a novel heterocyclic compound. A heterocyclic compound represented by general formula (1) wherein, R1 and R2, each independently represent hydrogen; a phenyl lower alkyl group that may have a substituent(s) selected from the group consisting of a lower alkyl group and the like on a benzene ring and/or a lower alkyl group; or a cyclo C3-C8 alkyl lower alkyl group; or the like; R3 represents a lower alkynyl group or the like; R4 represents a phenyl group that may have a substituent(s) selected from the group consisting of a 1,3,4-oxadiazolyl group that may have e.g., halogen or a heterocyclic group selected from pyridyl group and the like; the heterocyclic group may have at least one substituent(s) selected from a lower alkoxy group and the like or a salt thereof.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: December 8, 2015
    Assignee: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Akira Takahashi, Masaki Suzuki, Yuichi Nakamura, Yohji Sakurai
  • Patent number: 9195091
    Abstract: A liquid crystal display device sandwiching liquid crystal between a TFT substrate having a rectangular plane and an opposing substrate having a rectangular plane, wherein a long side of the TFT substrate is longer than a long side of the opposing substrate, the long side of the opposing substrate is formed with a chamfer, and a light shielding film made of metal is formed on the TFT substrate around a position corresponding to the center of the long side of the opposing substrate. By using the light shielding film, the chipping condition of the opposing substrate near the chamfer can be accurately and rapidly evaluated.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: November 24, 2015
    Assignee: JAPAN DISPLAY INC.
    Inventors: Makoto Tatemura, Yuichi Nakamura, Masaharu Itakura, Yoshitomo Ogishima
  • Publication number: 20150311983
    Abstract: A frequency offset compensation apparatus includes: first FFT means for performing a discrete-time Fourier transform of an input signal; second FFT means for performing a discrete-time Fourier transform; and offset compensation means for changing an order of output data of the first FFT means according to a frequency offset compensation amount, and rearranging the output data, and then inputting the output data to the second FFT means. This makes possible a frequency offset compensation without needing a new complex multiplier or a new memory in optical communication.
    Type: Application
    Filed: December 11, 2013
    Publication date: October 29, 2015
    Applicant: NEC Corporation,
    Inventors: Kohei HOSOKAWA, Yuichi NAKAMURA
  • Publication number: 20150156881
    Abstract: A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.
    Type: Application
    Filed: November 28, 2014
    Publication date: June 4, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Keisuke SHIMIZU, Yuichi NAKAMURA, Tsuyoshi YAMAGUCHI
  • Publication number: 20150101729
    Abstract: The invention provides a pneumatic radial tire which improves durability by lowering breakdowns in both of a ply end and a wind-up portion without an increase of weight and manufacturing cost. The pneumatic radial tire has a carcass layer which is provided between a pair of bead portions and is locked in a state in which end portions are wound up to the bead cores. The carcass layer is constituted by a first ply, a second ply and a third ply which are laminated one by one from an inner side to an outer side in a tire radial direction in a tire equator. The first ply and the third ply are wound up to the bead cores. The second ply terminates in a state in which the second ply is interposed between the first ply and the third ply, without reaching the bead cores.
    Type: Application
    Filed: August 5, 2014
    Publication date: April 16, 2015
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventor: Yuichi Nakamura