Abstract: A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.

Abstract: The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.

Abstract: A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.

Abstract: A printed circuit board including a metal conductor formed on a surface of an insulating base material and having a component mounting portion, and a solder resist covering a part of the metal conductor, includes a thinned part on a component-mounting-portion side in the solder resist.

Abstract: A printed wiring board is configured such that copper-laminated plates and prepregs are alternately laminated and surface conductive layers are arranged on the outermost positions outside the prepregs, wherein all leading wires from pads for surface-mount parts to be mounted on the surface of the printed wiring board are connected to inner conductive layers of the copper laminated plates through blind via holes connecting the surface conductive layer and the copper-laminated plate therebelow, and inner via holes connecting conductive layers on the top and rear surfaces of at least one of the copper-laminated plates that is nearest to the surface conductive layer are provided and a conductive film is formed in the inner via holes.

Abstract: A printed wiring board is configured such that copper-laminated plates and prepregs are alternately laminated and surface conductive layers are arranged on the outermost positions outside the prepregs, wherein all leading wires from pads for surface-mount parts to be mounted on the surface of the printed wiring board are connected to inner conductive layers of the copper laminated plates through blind via holes connecting the surface conductive layer and the copper-laminated plate therebelow, and inner via holes connecting conductive layers on the top and rear surfaces of at least one of the copper-laminated plates that is nearest to the surface conductive layer are provided and a conductive film is formed in the inner via holes.